FAQ

How to choose the correct thermal material?
Thermal management of LED module.
What is thermal interface materials?
What is thermal compound?
Thermal rate and thermal conductivity.
The difference of thermal grease and thermal pad.
The feature and application of thermal tape.
Product properties of thermal conductive.
How to properly apply the thermal paste to the CPU and GPU?
The application and category of TIM(Thermal Interface Materi

The category of thermal interface material includes thermal pad, thermal tape, thermal grease, thermal putty etc. TIM can fill the gap(0.1mm~20mm) between heat source and heat sink as a bridge to accelerate the efficiency of heat dissipating , cool down IC's temperature, increase its life and improve the performance.。

Illustration of the heat flow between a heat sink and circuit board using T-Global Li-98 Thermal Conductive Adhesive Tape

 

Thermal module consists of thermal interface material, copper block, heat pipe, heat sink and fan etc. Heat transferring from heat source, through TIM , copper block and heat pipe to heat sink. The TIM with larger thermal conductivity and area has better thermal performance. If the temperature of IC is high , the space in the device is small or the air flow in the device is bad, we will suggest to add a fan in your design to help dissipating the heat.

TIM can be used in a wide range of electronic products like notebook, laptop computer, telecom device, LCD TV, LED lighting equipment, power supply Unit PSU, DDR Memory Module etc.

 

Below are the different types and composition of thermal interface materials:

1. Thermal potting compound: the heat curing gel composed of epoxy/or silicone and oxidized metal powders.

2. Thermal tape: double side adhesive with acrylic base, silicone base material are available. Some items with fiberglass mesh or polyimide can meet the special functionality required by customer

3. Thermal pad: One is solid pad, the other is phase change material which will turn to liquid when the temperature exceeds 50℃.

 

The key element when selecting thermal interface material:

1. The material: Silicone or non-silicone(like acrylic base, epoxy base)

2. Thermal conductivity: Most of the TIMs K-value is between 0.98W/mK~12W/mK. Some special items can reach 400 W/mK,1500~1800 W/mK are also available.

3. Hardness: Shore00 25~ShoreA 90 are available

 

Compression rate:

Please notice the instruction in our SPEC to optimize the thermal performance.

 

Working environment:

Please notice the instruction in our SPEC to ensure the working safety.

The meaning of compressibility relative to TIM.
The meaning of hardness relative to TIM.
What is silicon or non-silicon thermal pad?
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