![[New Product Launch] Low Bleed Series Thermal Pad](https://www.tglobalcorp.com/upload/news_list_pic/Low-Bleed-Series-Thermal-Pad-525-en.jpg__24F13l1bKO.jpg)
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SOLUTIONS
Comprehensive Heat Dissipation Engineering Services Entrusted to T-Global Technology
SERVERS
For various server types, such as 1U and 2U, we focus on liquid-cooling and air-cooling heat dissipation technologies. Each of these design principles has its own pros and cons, as well as specific applications where they are most suitable. Different server specifications also have their own unique requirements and suitable deployment environments.
AUTOMOTIVE
T-Global is prepared to help you to open up more possibilities with electric and smart vehicles, including self-driving systems, safety assistance systems, transparent display components, Vehicle IoT and more. We believe that together we can shape the future of the "third living space" for EVs.
Heat Dissipation Product Series Introduction
PRODUCT
Comprehensive Thermal Engineering Products
Thermal Simulation
Vapor Chambers
Heat Pipes
Thermal Interface Materials
Heat Sinks
Thermoelectric Cooling Chips
Flexible Absorbing Materials
Fan
PRODUCT CATEGORY
PRODUCT CATEGORY
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Thermal Simulation -
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Vapor Chambers -
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Heat Pipes -
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Thermal Interface Materials -
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Heat Sinks -
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Thermoelectric Cooling Chips -
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Flexible Absorbing Materials -
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Fan
About Us
ABOUT T-Global
The global first choice for heat dissipation products, meeting your needs.
T-Global products and services solve your heat dissipation problems. We pride ourselves on our culture of being forward-looking, targeting the future of new energy, 5G, electric vehicles and other emerging technologies, and focusing on building long-term, stable relationships with our partners to earn the trust of our customers, partners and employees.
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![CONSULTATION]()
CONSULTATION
Dedicated consultation
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![14 DAYS]()
14 DAYS
The fastest delivery time is 14 days
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![CUSTOMIZED]()
CUSTOMIZED
Customized production
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![NO MOQ]()
NO MOQ
No minimum order quantity
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![THERMAL SIMULATION]()
THERMAL SIMULATION
Thermal Simulation Analysis Services
LATEST NEWS
Global Thermal Solutions: Your Ultimate Choice
Product News
08
24.May
【Two New Ultra-Soft High Conductivity Thermal Pads Have Gone to Market】
【Two New Ultra-Soft High Conductivity Thermal Pads Have Gone to Market】Specifically developed for network communications, cloud computing, servers, and other high-speed computing industries, these new products have outstanding thermal conductivity (6.5-7.5 W/m·K) and achieve an ultra-soft texture of Shore OO 25. Only a light amount of pressure is needed to achieve a seamless fit and fill the gaps between electronic components and heat sinks. This enables quicker and more effective heat dissipation, enhancing overall cooling performance.