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SOLUTIONS

Comprehensive Heat Dissipation Engineering Services Entrusted to T-Global Technology

Heat Dissipation Product Series Introduction

PRODUCT

Comprehensive Thermal Engineering Products

Thermal Simulation

Thermal Module

Vapor Chambers

Heat Pipes

Thermal Interface Materials

Heat Sinks

Thermoelectric Cooling Chips

Flexible Absorbing Materials

PRODUCT CATEGORY
PRODUCT CATEGORY

About Us

ABOUT T-Global

The global first choice for heat dissipation products, meeting your needs.

T-Global products and services solve your heat dissipation problems. We pride ourselves on our culture of being forward-looking, targeting the future of new energy, 5G, electric vehicles and other emerging technologies, and focusing on building long-term, stable relationships with our partners to earn the trust of our customers, partners and employees.

  • CONSULTATION

    CONSULTATION

    Dedicated consultation

  • 14 DAYS

    14 DAYS

    The fastest delivery time is 14 days

  • CUSTOMIZED

    CUSTOMIZED

    Customized production

  • NO MOQ

    NO MOQ

    No minimum order quantity

  • THERMAL SIMULATION

    THERMAL SIMULATION

    Thermal Simulation Analysis Services

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LATEST NEWS

Global Thermal Solutions: Your Ultimate Choice

Smart City Summit & Expo X 2050 Net Zero City Expo
Events
17

26.Mar

Smart City Summit & Expo X 2050 Net Zero City Expo

TaiNEX 2
Booth:Q0723

Next-Gen Phase Change Material TG-PCM095 : Delivering Exceptional Thermal Performance for High-Heat Density Devices
Product News
10

25.Dec

Next-Gen Phase Change Material TG-PCM095 : Delivering Exceptional Thermal Performance for High-Heat Density Devices

Leveraging deep materials expertise and years of thermal R&D experience, T-Global Technology introduces the next-generation TG-PCM095 Phase Change Materials—a thermal interface solution that delivers high efficiency, stability, and long-term reliability for power modules, communication equipment, electric vehicles, and high-density computing applications.

Breaking the Boundaries of M.2 SSD Thermal Module | M.2 Fan SSD Thermal Module Unlocks Next-Generation Storage Performance
Product News
02

25.Oct

Breaking the Boundaries of M.2 SSD Thermal Module | M.2 Fan SSD Thermal Module Unlocks Next-Generation Storage Performance

To meet the future demands of high-power M.2 SSD, T-Global developed the M.2 Fan SSD Thermal Module. The module is equipped with TG-A6200 Ultra-Soft Thermal Pad and integrated with a 20x20x6.5mm hydraulic bearing fan. Capable of reaching a maximum speed of 17,000 ± 20% RPM, the fan operates with a low startup voltage and current of 7.0V/0.10A, delivering stable and powerful airflow to ensure effective cooling.

Tackle High-Heat Challenges – TG-ASD50AB Thermally Conductive Gel Officially Launched
Product News
22

25.Jul

Tackle High-Heat Challenges – TG-ASD50AB Thermally Conductive Gel Officially Launched

Discover TG-ASD50AB with 5.0 W/m·K thermal conductivity, optimized for 5G, EV, servers, and smart devices. RoHS & REACH compliant, ideal for high-efficiency thermal management.

T-Global Technology Obtains Six Patent Certifications, Reaching New Heights in Technological Innovation
T-Global NEWS
21

25.Jan

T-Global Technology Obtains Six Patent Certifications, Reaching New Heights in Technological Innovation

T-Global Technology, a leading provider of thermal management solutions, has obtained six technical patents this year, covering thermal system technology, 3D vapor chamber structure, and vapor chamber sealing technology. These patents demonstrate the company’s outstanding achievements in research and development and further strengthen its leadership in high-performance thermal management technology.

Vapor Chamber Heat Sink: Unlocking Superior Cooling
Blog
21

25.Jan

Vapor Chamber Heat Sink: Unlocking Superior Cooling

Learn how vapor chamber heat sinks provide superior cooling for high-power electronics with cutting-edge thermal management and designs.

Engineered for High-Speed Computing – High-Performance Ultra-Soft Thermal Pad
Product News
10

24.Dec

Engineered for High-Speed Computing – High-Performance Ultra-Soft Thermal Pad

This thermal pad's ultra-soft texture can effectively fill the gaps between electronic components and heat sinks, achieving a seamless fit.

Comprehensive Guide to Heat Sink Design
Blog
14

24.Nov

Comprehensive Guide to Heat Sink Design

This is a thorough guide to heat sink design for optimal thermal resistance. It also includes heat sink types, design techniques, and manufacturing.

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