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SOLUTIONS

Comprehensive Heat Dissipation Engineering Services Entrusted to T-Global Technology

Heat Dissipation Product Series Introduction

PRODUCT

Comprehensive Thermal Engineering Products

Thermal Simulation

Vapor Chambers

Heat Pipes

Thermal Interface Materials

Heat Sinks

Thermoelectric Cooling Chips

Flexible Absorbing Materials

PRODUCT CATEGORY
PRODUCT CATEGORY

About Us

ABOUT T-Global

The global first choice for heat dissipation products, meeting your needs.

T-Global products and services solve your heat dissipation problems. We pride ourselves on our culture of being forward-looking, targeting the future of new energy, 5G, electric vehicles and other emerging technologies, and focusing on building long-term, stable relationships with our partners to earn the trust of our customers, partners and employees.

  • CONSULTATION

    CONSULTATION

    Dedicated consultation

  • 14 DAYS

    14 DAYS

    The fastest delivery time is 14 days

  • CUSTOMIZED

    CUSTOMIZED

    Customized production

  • NO MOQ

    NO MOQ

    No minimum order quantity

  • THERMAL SIMULATION

    THERMAL SIMULATION

    Thermal Simulation Analysis Services

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LATEST NEWS

Global Thermal Solutions: Your Ultimate Choice

Electronica 2024
Events
12

24.Nov

Electronica 2024

Trade Fair Center Messe München
Booth:Hall B6.328/1

Instruction on Calculating Heat Sink Size
Blog
01

24.Oct

Instruction on Calculating Heat Sink Size

Let's explore how to calculate heat sink size, including input parameters, calculator interface, advanced considerations, and calculator results.

Understanding Heat Sinks: Types, Technology, and How It Works
Blog
05

24.Aug

Understanding Heat Sinks: Types, Technology, and How It Works

Discover how heat sinks protect your electronics from overheating, the different types of heat sinks, and the materials used for maximum efficiency in cooling.

[New Product Launch] Low Bleed Series Thermal Pad
Product News
12

24.Jun

[New Product Launch] Low Bleed Series Thermal Pad

The properties of thermal conduction materials employed directly affect the performance and life span of electronics with high-speed computing and processing abilities.

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