Thermal Interface Material

Thermal Conductivity(W/mk)
Dielectric Breakdown Voltage(KV)
Hardness
Material Type
0results

Thermal interface materials have been generally used in all heat dissipation modules to fill the gaps and uneven holes on the surface of the electronic materials, otherwise it will seriously hinder heat conduction. With the pursuit of high-power performance in electronic products, in addition to the pursuit of thermal conductivity of thermal interface materials, material reliability and the reduction of interface thermal resistance are more important issues.

 

Heat Theorem

The surface of different components may have unevenness that is not visible to the naked eye, which greatly reduces the contact area between the two surfaces.

 


Selection Guide

The types of thermal interface materials include thermal pad, thermal tape, thermal grease, and thermal putty. In order to accelerate heat transfer by filling the gap between the chip heat source and the heat sink, the heat energy of the chip is effectively transferred to the heat sink fins, which also improves the life of the chip and the product usage efficiency.

 

Vertical
plate paste special type
high thermal conductivity high viscosity low thermal resistance high viscosity Mature curing  Fast cooling insulation

Thermal Pad

Thermal Tape

Thermal Grease

Thermal Putty

Potting Compound

Phase Change Materials

Thermal Insulation Rubber Cap

 It can effectively reduce the contact thermal resistance between the surface of heat source and the contact surface of heat dissipation components. With high thermal conductivity, high adhesiveness and low thermal resistance Effective in filling uneven surface areas A thermal interface material with a softness between thermal grease and thermal pad Protecting electronic components from influences from the external environment after being cured Good fluidity of the material after melting, it can completely fill the uneven gap on the surface. Easy to install components,Reducing product weight
Thermal Pad Thermal Tape Thermal Grease Thermal Putty Potting Compound Phase Change Materials Thermal Insulation Rubber Cap

 

Horizontal
Graphite Sheet Thermal Composite Material
Thin_and_light Containing_copper_foil bendable Good insulating,good tensile strength

Graphite Sheet

Graphene

Heat Spreader

Thermal Insulator

Ultra high thermal conductivity,electrical conductivity and EMI shielding effect Graphene has good horizontal conductivity, will not have the problem of peeling and powder falling. Metal-based, with a radiant paint coating, can more effectively in product’s heat dissipation. Polyimine is used as a substrate and is commonly used in electronic products that require high electrical insulation.
Graphite Sheet Graphene Heat Spreader Thermal Insulator

 

All heat dissipation begins with thermal conductivity.

When new electronic products are introduced, the IC process and chip efficiency are greatly increased according to the production process capability and market demand, and the user experience must be taken into account to pursue the thin, light weight, small, and high efficiency, resulting in high density of heat on the surface of the heating element. The heat is continuously transferred to the heat sink through thermal conduction, and eventually the thermal balance is achieved without overloading the product's mechanical components.Due to the contact surface of different components between products, there is a so-called interface thermal resistance to be considered when heat is transferred. Moreover, the surface of different components may have unevenness that is not visible to the naked eye, which greatly reduces the contact area between the two surfaces. In this case, it is necessary to rely on the Thermal Interface Material (TIM) to fill the micro voids and uneven surface holes created when the two materials are joined or contacted to reduce the resistance to heat transfer.


By using different thermal interface materials, the most suitable thermal resistance, heat flux, compressibility, hardness can be selected for different product designs, which is the key point to be considered at the early stage of product design.

   Thermal conductivity
   The ability of a given material to conduct/transfer heat

   Dielectric Breakdown Voltage

   The voltage at which a given insulating object becomes conductive

   Hardness

   Higher softness numbers indicate harder materials.

TOP