Vapor Chamber

thermalpad

Vapor Chamber

 ●Two-dimensional surface propagation ●Passive component ●High stability


Its function and working principle are the same as that of a heat pipe, which operates in a cyclic manner by evaporating and condensing an active fluid enclosed in a plate-like chamber. It is a high performance heat conduction device that can quickly transfer the local heat source to a large area of the plate.

 

Heat dissipation mechanism

 

The vapor chamber is a vacuum sealed chamber with capillary structure inside, and the working fluid absorbs heat and vaporizes rapidly, and moves to the condensation area, and after exchanging heat with the outside, it condenses into liquid and flows back, and the cycle starts again and again.

 

 

The vapor chamber is a device that can quickly transfer high temperature point heat source to a large area for heat dissipation. Its function and working principle is the same as that of a heat pipe, which operates in a cycle by evaporating and condensing fluid enclosed in a plate-like chamber. The full range of 3D heat transfer methods of the vapor chamber can more effectively solve the severe and high power thermal problems. At present, T-Global Technology is committed to developing ultra-thin thermal vapor chambers of 0.4mm or less.


Vapor Chamber
A vapor chamber, sometimes called a flat heat pipe, uses a flat format of two-phase cooling with high heat transfer capability. For electronic cooling applications, the heat energy transfer is usually done on a heat sink very close to the heat source; making the vapor chamber assembly ideal for diffusing high heat density or heat load over a larger surface. By using a vapor chamber, you can expect increased and more uniform heat dispersion, which is ideal for optimizing the performance of the heat sink. The use of vapor chamber has increased significantly because the total power and the resulting power density have increased dramatically as a result of the reduced chip size. In terms of price and application flexibility, today's vapor chambers are more capable and less costly than they were a decade ago.


 
   Single point high temperature heat source for fast cooling
   The thermal conductivity is more than 10 times that of heat pipes, which can solve the single point heat problem more quickly.

   3D heat transfer structure

   Compared with the traditional 2D heat transfer technology, the three-axis heat transfer structure can realize the dream of full performance of electronic devices.

   Flexible accessory combination

   Your heat dissipation module offers the most flexible design structure and the most customized production, as long as you can think of.

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