Thermal pad ●Great thermal conductivity ●Good compressibility ●Self-adhesive Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.

 

Thermal pad is also known as thermal conductive silicone gap filler, thermal gasket, soft thermal pad and other different names. Generally speaking, thermal pad is composed of silicone gel combined with thermal conductive powder to achieve different characteristics such as thermal conductivity, insulation, and compressibility.

 

Thermal conductivity (W/mK)

2~4

4~6

6~8

8~10

10~12

12~14

14~16

16~18

18~20

20~22

22~24

24~26

Hardness (Shore00)

11~20

TG-A2200

21~30

31~40

TG-A3500

41~50

TG-A4500

TG-A6200

TG-A9000

51~60

TG-A20KX

TG-A38KX

TG-ALC

TG-A1250

TG-A1450

61~70

TG-A1660

TG-A1780

71~80

81~90

TG-AH25

Taking into consideration the gap distance between the heating element and the heat sink, the tolerance, and the mechanism of assembly, the smaller the thickness, the larger the thermal conductivity, and the larger the contact area, the more effective the thermal conductivity can be, provided that the Thermal Pad can effectively contact the surfaces of both objects.

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Thermal Conductivity	Dielectric Breakdown Voltage	Hardness
The thermal conductivity of a material is a measure of its ability to conduct heat.	Dielectric breakdown voltage is a long reduction in the resistance of an electrical insulator when the voltage applied across it exceeds the breakdown voltage.	Higher numbers on the scale indicate a greater resistance to indentation and thus harder materials.