Thermal Interface Material

Thermal Pad


Thermal pad

●Great thermal conductivity ●Good compressibility ●Self-adhesive

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.


Thermal pad is also known as thermal conductive silicone gap filler, thermal gasket, soft thermal pad and other different names. Generally speaking, thermal pad is composed of silicone gel combined with thermal conductive powder to achieve different characteristics such as thermal conductivity, insulation, and compressibility.


    Thermal conductivity (W/mK)
    2~4 4~6 6~8 8~10 10~12 12~14 14~16 16~18 18~20 20~22 22~24 24~26

Hardness (Shore00)

11~20 TG-A2200                      
31~40 TG-A3500                      
41~50   TG-A4500 TG-A6200 TG-A9000                
51~60 TG-A20KX TG-A38KX TG-ALC     TG-A1250 TG-A1450            
61~70             TG-A1660 TG-A1780        
81~90                       TG-AH25

Taking into consideration the gap distance between the heating element and the heat sink, the tolerance, and the mechanism of assembly, the smaller the thickness, the larger the thermal conductivity, and the larger the contact area, the more effective the thermal conductivity can be, provided that the Thermal Pad can effectively contact the surfaces of both objects.

Thermal Conductivity Dielectric Breakdown Voltage  Hardness
The thermal conductivity of a material is a measure of its ability to conduct heat. Dielectric breakdown voltage is a long reduction in the resistance of
an electrical insulator when the voltage applied across it exceeds the breakdown voltage.
Higher numbers on the scale indicate a greater resistance to
indentation and thus harder materials.