In the revolutionary era of consumer electronics, all mobile phones, tablets, laptops, gaming computers, wearable devices, smart electronics, etc., are seeking powerful performance and are moving towards lightweightness and small size, and multi-functional use, making thermal dissipation performance a modern-day popular research topic.
Good heat dissipation is the key to success in product performance. To shrink the size of the products, the space for heat dissipation is constantly being compressed. With the development of high-tech and nano-processing technologies, more innovative products have emerged to process huge amounts of data, and more transistors have been packed into the integrated circuit to process large amounts of data, resulting in higher thermal density and requiring better thermal conductivity and dissipation technologies to maintain the reliability and lifetime of the products.
In the case of thin and light laptops, the typical thermal module for a laptop is composed of two heat pipes, while a gaming laptop uses up to seven and can consume 100 to 200 watts. This is where the thermal module constitutes a necessary solution by taking the heat dissipation function into account from the very beginning of the mechanism design and integrating a diverse thermal product chain to address the heat problem.

Applications:
GPUs for Gaming Monitors, Industrial PCs, Solid State Drives, Laptops, Gaming Computers, Wafer Devices, Sputtering Devices, Semiconductor Devices