5G Implement

Only nine years after the launch of 4G networks, the world is now embracing the era of 5G technology. 5G offers 10 times better communication technology than 4G, ultra-low transmission latency. In order to realize the vast array of 5G services, it is critical that the technology evolution of the underlying 4G infrastructure is consistent and reliable, and that different deployment plans and fiber optic transmission technologies are utilized to meet the capacity and improve the latency of 5G. The Wi-Fi6 technology, which was launched alongside 5G technology, covers both high and low speed devices in the 2.4GHz and 5GHz bands and delivers four times more traffic than 5G. In the coming years, 5G networks combined with Wi-Fi6 will provide better network coverage.

In addition to the higher speed and capacity of 5G, the heat dissipation issues behind it are even more critical. Small base stations, edge computing devices and AI computing all require high wattage heat solutions, while consumer electronic devices such as mobile phones and the IoT, which support 5G services, also necessitate a considerable load to prevent overheating of components that could reduce system efficiency or cause direct thermal shutdown.
With years of experience in thermal engineering and research knowledge from academic collaborations with universities, T-Global can not only address your current thermal challenges, but can also work with you to build a promising industry for 5G applications.


Communication Antenna Module, 5G Chip, Surveillance System, Radar System, Base Station

Fiber Optic Modules

Optical fiber modules produce a relatively large amount of heat, and given the limited internal space in the product design and demand for reliability, products with a high thermal conductivity are often chosen.

base Station

As long-term reliability is more important, it is advisable to opt for products that are made of soft materials and have a lower overall thermal resistance. Networks rely on switching and processing technology to achieve 3G, 4G and now even 5G. As data traffic continues to rise, the network switching center base station must maintain a smooth flow of data at all times, generating relatively more heat, and with the limited internal space in the product design and the need for reliability, high thermal conductivity products are often preferred. The solutions vary from low to high power. For example, heat pipes made of copper, combined with thermal interface materials, heat sink fins and fans, depending on the design of the mechanism, can effectively cope with heat loads of up to 100W.

Recommended Products

T-Global has extensive thermal experience and offers the most flexible and bespoke thermal engineering services for each project, allowing you to purchase the full range of thermal materials here.


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