2025.01.21
T-Global NEWS

T-Global Technology Obtains Six Patent Certifications, Reaching New Heights in Technological Innovation

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T-Global Technology, a leading provider of thermal management solutions, has obtained six technical patents this year, covering thermal system technology, 3D vapor chamber structure, and vapor chamber sealing technology. These patents demonstrate the company’s outstanding achievements in research and development and further strengthen its leadership in high-performance thermal management technology.


Breakthrough Technological Innovations

1.Three Thermal System Technologies

T-Global Technology has optimized thermal system design by improving the thermal conductivity and structural stability of materials. This significantly enhances heat dissipation performance while reducing power loss, meeting the growing demand for high efficiency and miniaturization in next-generation electronic devices.

2.3D Vapor Chamber Structure Technology

This patent addresses the challenges of uniform heat distribution in high-density electronic modules. By adopting an innovative 3D structure design, it significantly improves heat equalization speed and durability, providing a reliable and high-efficiency thermal solution for advanced semiconductor devices.

3.Penetrative 3D Vapor Chamber Structure Technology

To meet the needs of extreme environmental applications, T-Global Technology has developed a penetrative design that enables multi-directional heat dissipation. This design enhances structural strength while maintaining high thermal conductivity, representing a revolutionary breakthrough in high-efficiency thermal management solutions.

4.Vapor Chamber Sealing Structure Technology

The next-generation sealing structure technology improves manufacturing precision and packaging stability, reducing heat loss and production costs. This advancement enhances product reliability while aligning with sustainable development principles.

 

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From Technological Innovation to Practical Application

Compared to previous technologies, these newly patented innovations significantly improve key performance indicators such as thermal conductivity, structural strength, and product lifespan, reaching industry-leading standards. These breakthroughs are not only applicable to high-performance computing, AI servers, and semiconductor devices but also have broad applications in consumer electronics and new energy vehicles, creating greater value for customers.


Focusing on the Future, Advancing Technology Together

T-Global Technology remains committed to technological innovation, striving to meet industry demands and provide comprehensive thermal solutions. The certification of these six patents is not only a recognition of the company’s years of technological accumulation but also marks a new step forward in the company’s global market competitiveness.

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