TG-N909 Non-Silicone Thermal Grease
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●High thermal conductivity
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●Silicone oil free
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●No overflow
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●Low thermal impedance/thermal resistance
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●Non-silicone base, no Environmental pollution
●High thermal conductivity
●Silicone oil free
●No overflow
●Low thermal impedance/thermal resistance
●Non-silicone base, no Environmental pollution
TG-N909 is a non-silicon thermal conductive paste launched by T-Global in 2019. It is with 9W/m•K thermal conductivity also it’s high-performance thermal conductive material without siloxane. There will be no evaporation of silicone resin and no precipitation of silicone oil. The low thermal resistance of non-silicon thermal paste can absorb high-wattage chip heat, thereby improving the efficiency and service life of heating electronic components.
Application
Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIoT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED, Motherboard,Power Supply, Heat Sink, LCD-TV, NB, DT, Tablet PC, Telecom Device, Wireless Hub, DDR4 Module, etc.
It is suitable for optical instruments and silicon-sensitive equipment, such as CPU, chip cooler, LED electrical appliances. Compared with common silicon-type thermal paste, it is like a whole new world, allowing you to use it without silicon oil volatilization. The worries of the future, as long as the general thermal paste can be used, will not worry too much. It will show its excellent thermal conductivity. Any heating element and the radiator can let it grow.
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| Find a high-purity solvent and cloth. |
Wipe the surface of the CPU and the entire heat sink assembly. |
Use the center-point application method |
spread the thermal paste evenly |
Put the cover back on the heat sink |
| T-Global Thermal Paste | |
|---|---|
| *Non-Silicone | - |
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TG-N909 is suitable for optical instruments |
TG-S808 is widely used in the design |
| Thermal Conductivity：9 W/m•K | Thermal Conductivity：8 W/m•K |
| Density：2.85g/cm3 | Density：2.9 g/cm3 |
| Working Temperature：-40~+200 °C | Working Temperature：-40~+200 °C |
| Volume Resistance：>1013 Ohm-m | Volume Resistance：>1013 Ohm-m |
Property table
| Properties | Unit | TG-N909 | Tolerance | Test Method |
| Thermal Conductivity |
W/m•K |
9 |
±10% |
ASTM D5470 Modified |
| Color |
– |
Gray |
– |
– |
| Oil Dispersible |
wt% |
<0.1 |
– |
24hr@150°C |
| Weight Loss |
wt% |
<0.1 |
– |
ASTM E595 Modified |
| Viscosity | Pa·s | 300 | ±100 | Brookfield |
| Density |
g/cm3 |
2.85 |
±5% |
ASTM D792 |
| Operating Temperature |
°C |
-40~+200 |
– |
– |
| Volume Resistivity | Ohm-m | >10¹³ |
– |
ASTM D257 |
| Standard Package |
– |
Pot |
– |
– |
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●Compliance with RoHS ●Thermal paste has a shelf-life of 12 months fr om the date of manufacture, as indicated by the lot number, when stored in the original, unopened ●If an oil layer occurs on top of the thermal paste, it belongs to a normal phenomenon. We suggest to stir it evenly before usage. |
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(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
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●Low thermal resistance/low thermal resistance
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●Organic silicon base material has no environmental pollution
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