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TG-N909 Non-Silicone Thermal Paste
- High thermal conductivity
- Silicone oil free
- No overflow
- Low thermal impedance/thermal resistance
- Non-silicone base, no Environmental pollution
TG-N909, launched by T-Global, is a non-silicon thermal conductive paste with a thermal conductivity of 9W/m•K. This high-performance material is free of siloxane, ensuring that there is no evaporation of silicone resin or precipitation of silicone oil. Its low thermal resistance allows it to effectively absorb the heat generated by high-wattage chips, thereby enhancing the efficiency and lifespan of electronic components.
It is suitable for optical instruments and silicon-sensitive equipment, such as CPU, chip cooler, LED electrical appliances. Compared with common silicon-type thermal paste, it is like a whole new world, allowing you to use it without silicon oil volatilization. The worries of the future, as long as the general thermal paste can be used, will not worry too much. It will show its excellent thermal conductivity. Any heating element and the radiator can let it grow.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
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Find a high-purity solvent and cloth. |
Wipe the surface of the CPU and the entire heat sink assembly. |
Use the center-point application method. |
Spread the thermal paste evenly. |
Put the cover back on the heat sink. |
Properties
Unit
TG-N909 Non-Silicone Thermal Paste
Testing methods
Thermal Conductivity
W/m•K
9±10%
ASTM D5470 Modified
Color
Gray
–
Oil Dispersible
wt%
<0.1
24hrs @150°C
Weight Loss
wt%
<0.1
ASTM E595 Modified
Viscosity
Pa•s
300±100
Brookfield
Density
g/cm³
2.85±5%
ASTM D792
Operating Temperature
°C
-40~+200
–
Volume Resistivity
Ohm-m
>10¹³
ASTM D257
Standard Package
Pot
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