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TG-A730AB / S730AB Potting Compound
- Good thermal conductivity
- Heat curing
- Can be applied with pistol
- Low viscosity
- Easy to assemble
TG-A730AB / S730AB is a silicone potting compound with 2.1W/m•K thermal conductivity and the mixing ratio is 1:1 which is easy to mix, can be matched with an extrusion gun for easy operation and easy construction, TG-A730AB / S730AB thermally conductive sealant also has high stability, low viscosity, and quick-drying And other excellent characteristics.
TG-A730AB / S730AB thermally conductive sealant is suitable for electronic components. After heating and curing, it has high hardness and can be used for support. After curing, it can protect the mechanism and prevent it from being affected by the external environment.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Properties
Unit
TG-A730AB / S730AB Potting Compound
Testing methods
Thermal Conductivity
W/m•K
2.1±10%
ASTM D5470 Modified
Color
Gray
–
Dielectric Breakdown Voltage
KV/mm
≥11
ASTM D149
Volume Resistivity
Ohm-m
1*10¹²
ASTM D257
Density
g/cm³
2.3±5%
ASTM D792
Operating Temperature
°C
-50~+200
–
Viscosity
Pa·s
6~12
Brookfield
Curing Time @25°C
180
–
Curing Time @60°C
15
–
Curing Time @100°C
5
–
Hardness
Shore
A 60±10
ASTM D2240
Mixing Ratio
gram
1:1
–
Standard Package
Tube/Pot
–