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TG6060 Thermal Putty
- Silicone-type spacer with great long term reliability
- Lower thermal resistance than thermal pads
- Physical property between liquid and solid state
- Elimination of different gap between heat source and the heatsink
- Can be applied with dispenser
TG6060 is a thermal putty its 6.3W/m•K thermal conductivity also contains silicone cement.
This thermal pad is a relatively low thermal resistance due to its mud-like texture. Suitable for products with uneven heat sources. A small amount of cement can fill the gaps on the surface of the heat source to achieve excellent thermal conductivity. Compared with thermal paste, it is more convenient for construction and it has the characteristics of non-overflow and non-hardening. It is characterized by low thermal resistance, softness, strong plasticity, and environmental protection.
This thermal pad has good plasticity and is filled in the heat source and heat sink in between, it can be easily used on uneven surfaces to eliminate air gaps and it can be operated with dispenser equipment. Widely used in network communication equipment, electronics, and automobiles components and other industries have physical characteristics between liquid and solid Performance, with excellent caulking effect.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Operation Manual
Push the latch and insert the stick.
Put the tube in and twist.
Close the cover.
Take off the plug.
Properties
Unit
TG6060 Thermal Putty
Testing methods
Thermal Conductivity
W/m•K
6.3±0.3
ASTM D5470 Modified
Color
Blue
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Operating Temperature
°C
-50~+180
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Density
g/cm³
3.3±5%
ASTM D792
Viscosity
Pa·s
270±50
Brookfield
Volume Resistivity
Ohm-m
10¹³
ASTM D257
Standard Package
Tube/Pot
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