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TG-V838 Phase Change Materials
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TG-V838 Phase Change Materials
- With the good flow ability over phase change temperature,surface irregularities can be well filled.
- Low thermal impedance
TG-V838 is a thermal phase change material this phase change material is a heat-enhanced polymer, used to meet the thermal conductivity of high-end thermal conductivity applications, and has high reliability. The thermally conductive phase change material is solid at room temperature, which is convenient for customers to assemble. When the device reaches the working temperature, the material will be melted into a liquid state, and the gaps on the uneven surface of the component can be fully filled with good fluidity to reduce thermal resistance and improve the thermal efficiency of products is often used in chipsets, processors, semiconductors and other products.
TG-V838 phase change material makes the temperature of the system stable and it can reach the effect of approximately constant temperature through the process of heat absorption and heat release of the material. At present, it has been used in the cooling of high-power power electronic devices, the cooling of solar energy systems, building materials, industrial waste heat utilization, air-conditioning systems for household vehicles, and thermal management systems for lithium batteries.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Properties
Unit
TG-V838 Phase Change Materials
Testing methods
Thermal Conductivity
W/m•K
3.8±10%
ASTM D5470 Modified
Thickness
mm
0.13/0.2
ASTM D374
Color
Gray
–
Breakdown voltage(AC)
KV
≥1
ASTM D149
Operating Temperature
°C
-40~+125
–
Phase Transition Temperature
°C
50
–
Density
g / cm³
2.5±0.3
ASTM D792
Volume Resistivity
Ohm-m
3×10¹⁰
ASTM D257
Thermal Impedance @10psi
°C*cm²/W
0.546
ASTM D5470 Modified
Thermal Impedance @30psi
°C*cm²/W
0.487
ASTM D5470 Modified
Thermal Impedance @50psi
°C*cm²/W
0.454
ASTM D5470 Modified
Dielectric Constant @1MHz
13.3
ASTM D150