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TG-NSP25 Non-Silicone Thermal Putty
- Silicone free thermal gel
- Shapeable and compressible
- Low thermal resistance
- No fluidity
-
Best for north bridge IC
TG-NSP25 non-silicone thermally conductive paste is a kind of silicone-free thermally conductive paste with 2.6W/m•K thermal conductivity. It has the character of sufficient compressibility and low thermal resistance. It can fill the gaps on the surface of the heat source with a small amount of mortar to achieve excellent thermal conductivity. Compared with thermal paste, it is more convenient for construction and has the characteristics of non-overflow and non-hardening.
TG-NSP25 This product is a silicone-free thermal conductive paste and the color of this product is grey. The advantage of this product is that there is no thermal gel containing silicone oil. It can be shaped and pressed arbitrarily, and Low thermal resistance, working temperature can reach up to 150 degrees high temperature, its material is motor body, without the trouble of liquid flow phenomenon, it is very suitable for the material applied on the IC north bridge.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
| Thermal Impedance | Initial | 200Hr | 400Hr | 700Hr | 1000Hr |
| 125℃ Aging | 0.050 | 0.051 | 0.050 | 0.051 | 0.052 |
| 85℃ / 85% RH | 0.050 | 0.049 | 0.049 | 0.049 | 0.050 |
Operation Manual
Push the latch and insert the stick.
Put the tube in and twist.
Close the cover.
Take off the plug.
Properties
Unit
TG-NSP25 Non-Silicone Thermal Putty
Testing methods
Thermal Conductivity
W/m•K
2.6±10%
ASTM D5470 Modified
Color
Gray
–
Operating Temperature
°C
-50~+150
–
Density
g/cm³
2.6
ASTM D792
Viscosity
Pa·s
5000
Brookfield
Volume Resistivity
Ohm-m
10¹⁴
ASTM D257
Standard Package
Tube/Pot
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