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TG-N4000 Non-Silicone Thermal Putty
- Silicone free thermal gel
- Lower contact thermal impedance than thermal pads
- Physical property in between liquid and solid state
- Gap fillers for uneven or irregular surfaces of heat sources and heat sink
- Applicable for dispenser
This hybrid liquid and solid-state thermal conduction putty can effectively fill small and uneven gaps between two surfaces. It has extremely low thermal impedance and greatly improves thermal conduction efficiency. The product does not contain low-molecular-weight siloxane, and will not cause electrical contact failure problems.
It is especially suitable for optical products or mechanisms that contain sensitive electronic components. It is extremely stable and can maintain its excellent thermal conduction properties long-term.
Highly suitable for optical products, Advanced Driver Assistance Systems (ADAS), and sensitive electronic components.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Operation Manual
Push the latch and insert the stick.
Put the tube in and twist.
Close the cover.
Take off the plug.
Properties
Unit
TG-N4000 Non-Silicone Thermal Putty
Testing methods
Thermal Conductivity
W/m•K
4.0
ASTM D5470 Modified
Color
Blue Purple
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Operating Temperature
°C
-40~+125
–
Density
g/cm³
2.6
ASTM D792
Viscosity
Pa·s
350
Brookfield
Volume Resistivity
Ohm-m
≥10¹⁰
ASTM D257
Standard Package
Tube / Pot
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