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Thermal Interface Materials
Thermal Paste(Thermally Conductive Grease)
TG-AS606C / S606C Thermal Paste
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TG-AS606C / S606C Thermal Paste
- Good thermal conductivity
- Easy to assemble
- High stability
S606C is a thermal paste with 5.3W/m•K thermal conductivity this paste also known as the thermal paste is mainly used to assist heat sinks, commonly used computer IC wafers to dissipate heat, etc., because it can be used to apply only a thin layer, it can reach 1mm in the thinnest case, the maximum extent Reduce the thickness of the thermal interface material, so the thermal resistance can be minimized.
TG-S606C is our company’s largest shipment and the most mediocre thermal conductivity. It not only has the most moderate overflow and K value but is also the most mediocre thermal paste for all non-high-power products. Since only a thin layer can be applied in use, it can reach the level of 1mm in the thinnest case, which minimizes the thickness of the thermal interface material, so the thermal resistance can be minimized. It is more suitable for robot 3C electronics and other products. It can perfectly fill the gap and the problem of poor heat dissipation in the small gap, and because the thermal paste will gradually dry out after a long time\heat conduction, it is less suitable for products that cannot be replaced immediately, such as vehicles.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
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Find a high-purity solvent and cloth. |
Wipe the surface of the CPU and the entire heat sink assembly. |
Use the center-point application method. |
Spread the thermal paste evenly. |
Put the cover back on the heat sink. |
Properties
Unit
TG-AS606C / S606C Thermal Paste
Testing methods
Thermal Conductivity
W/m•K
5.3±10%
ASTM D5470 Modified
Color
Gray
–
Oil Dispersible
wt%
<0.05
24hrs @150°C
Weight Loss
wt%
<0.5
ASTM E595 Modified
Viscosity
Pa•s
150±50
Brookfield
Density
g/cm³
2.95±5%
ASTM D792
Operating Temperature
°C
-40~+180
–
Volume Resistivity
Ohm-m
>10¹²
ASTM D257
Standard Package
Tube/Pot
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