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TG-AS606B / S606B Thermal Paste
- Good thermal conductivity
- Easy to assemble
- High stability
S606B is a thermal paste with 1.9W/m•K thermal conductivity. The fluidity of this product is quite good. It can also fill up the very low thermal resistance of the contact interface itself segregated. Since this is a cost-competitive thermally conductive material, if such high thermal conductivity is not required and there is only a low budget for cost considerations, this type of product is highly recommended.
S606B has very good fluidity and can be used to fill up the very low thermal resistance of the contact interface, effectively reducing the heat group, and also exerting the effect of heat conduction. Compared with the trend that the design space of electronic products is getting smaller and smaller today, it is highly recommended for products that do not require too high thermal conductivity and are subject to a considerable range of space. This product is suitable for all kinds of electronic products that require heat dissipation, such as ICs. This type of product can be constructed by syringe or screen printing.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
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Find a high-purity solvent and cloth. |
Wipe the surface of the CPU and the entire heat sink assembly. |
Use the center-point application method. |
Spread the thermal paste evenly. |
Put the cover back on the heat sink. |
Properties
Unit
TG-AS606B / S606B Thermal Paste
Testing methods
Thermal Conductivity
W/m•K
1.9±10%
ASTM D5470 Modified
Color
White
–
Oil Dispersible
wt%
<0.2
24hrs @150°C
Weight Loss
wt%
<0.5
ASTM E595 Modified
Viscosity
Pa•s
200±80
Brookfield
Density
g/cm³
2.2±5%
ASTM D792
Operating Temperature
°C
-40~+180
–
Volume Resistivity
Ohm-m
>10¹¹
ASTM D257
Standard Package
Tube/Pot
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