T-Global 2026 Innovation Cultivation Program
Each year, T-Global Technology partners with universities and academic institutions to support hands-on engineering programs that cultivate future talent. Through initiatives such as Formula Student and related academic projects, student teams design, build, and validate high-performance systems under real-world constraints—gaining practical experience that prepares them for careers in engineering and advanced mobility industries.
Next-Gen Phase Change Material TG-PCM095 : Delivering Exceptional Thermal Performance for High-Heat Density Devices
Leveraging deep materials expertise and years of thermal R&D experience, T-Global Technology introduces the next-generation TG-PCM095 Phase Change Materials—a thermal interface solution that delivers high efficiency, stability, and long-term reliability for power modules, communication equipment, electric vehicles, and high-density computing applications.
Breaking the Boundaries of M.2 SSD Thermal Module | M.2 Fan SSD Thermal Module Unlocks Next-Generation Storage Performance
To meet the future demands of high-power M.2 SSD, T-Global developed the M.2 Fan SSD Thermal Module. The module is equipped with TG-A6200 Ultra-Soft Thermal Pad and integrated with a 20x20x6.5mm hydraulic bearing fan. Capable of reaching a maximum speed of 17,000 ± 20% RPM, the fan operates with a low startup voltage and current of 7.0V/0.10A, delivering stable and powerful airflow to ensure effective cooling.
