TSMC and ITRI are optimistic about liquid cooling! Taiwan Intel's first Open IP immersion solution
Intel (Intel) announced two new investment projects on the 19th, including the establishment of a giant laboratory covering an area of 200,000 square feet and the first Open IP immersion liquid cooling solution and reference design, which are expected to spend more than 700 million US dollars.
TG-A series product announcement
The continued advancement of the technology industry has seen a sharp rise in market demands for improved thermal management solutions which often means that thermal interface materials are upgraded as new products and technologies are developed and brought to market.
Electronics heats up after using! The researchers have come up an new way for cooling called “IC cooling”
Technology rises, the size of the electronics have become smaller and smaller. The heat generates when electricity passes by, heat overflow has now become an issue for reducing the scale.