NEWS

Liv2 Thermal Tape in Car Assembly Industry

【EETimes x 2035 E-Mobility】T-Global comprehensive heat dissipation/thermal engineering materials

T-Global Technology showcased its comprehensive heat dissipation/thermal engineering materials at the E-Mobility Taiwan Exhibition from April 17th to April 20th, 2024. On-site product demonstrations included TIMs (Thermal Interface Materials), Heat Dissipation Modules, Vapor Chambers, Heat Pipes, and Thermoelectric Cooling Chips (TECs).

【Event Recap】Campus Engagement and EV Industry Expansion Both at Home and Abroad! Experts in Heat Dissipation and Thermal Conduction, T-Global Showcase Technical Prowess at the Taipei AMPA Exhibition.

The Taipei International Automobile & Motorcycle Parts & Accessories Show (Taipei AMPA), which ranks among the world's four largest and Asia's second-largest international B2B automotive and motorcycle parts exhibition, successfully concluded recently. Many renowned manufacturers participated in this event, including T-Global, an expert in heat dissipation and thermal conduction technology. Leveraging the Taipei AMPA exhibition’s reputation as an industry barometer, T-Global showcased its robust capabilities in the field of heat dissipation and thermal conduction. 

【Two New Ultra-Soft High Conductivity Thermal Pads Have Gone to Market】

【Two New Ultra-Soft High Conductivity Thermal Pads Have Gone to Market】Specifically developed for network communications, cloud computing, servers, and other high-speed computing industries, these new products have outstanding thermal conductivity (6.5-7.5 W/m·K) and achieve an ultra-soft texture of Shore OO 25. Only a light amount of pressure is needed to achieve a seamless fit and fill the gaps between electronic components and heat sinks. This enables quicker and more effective heat dissipation, enhancing overall cooling performance.

University Student Dandelion Project(Taiwan Tech Racing Team)

Taiwan Tech Racing Team Achieves Impressive Results in Australia Expedition, winning the Best Contribution Award on their debut return to Taiwan. Among the battery modules, the TIM material was sponsored by T-Global Technology, utilizing the highest thermal conductivity TG-A1780 thermal pad, in active support of young students' pursuit of excellence and passion.

What is chip cold plate liquid cooling?

The cold plate of a chip is placed above the heat-generating components (CPU, GPU, memory modules) and absorbs and removes the heat from the chip through either single-phase or two-phase cold plates. Single-phase cold plate liquid cooling uses coolant circulating through the cold plate via the CDU to absorb the heat from the server.