Thermal Interface Material

Thermal Putty

TG-A7000 Putty Thermal Putty
TG-A7000 Putty Thermal Putty

•Silicone-type spacer with great long term reliability
•Lower thermal resistance than thermal pads
•Physical property between liquid and solid state
•Elimination of different heat source gap & heat sink
•Can be applied with dispenser

TG-A7000 is a thermal putty T-Global has developed for the mortar industry with 7.0 W/MK ultra-high thermal conductivity. It optimizes the heat dissipation performance of the product also it has an ultra-low heat group. This thermally conductive mortar is paste-like paste stickers, product design does not need to take special consideration of product size and tolerance restrictions, and can be flexibly designed according to the optimal effect of the design.

Application

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.

Thermally conductive gels are widely used in LEDs, microprocessors, memory modules, cache memories, sealed integrated chips, DC/DC converters, IGBTs and other power modules, power semiconductors, solid-state relays, and bridge rectifiers.

Property table

Properties

TG-A7000 Putty

Unit Tolerance Test Method
Thermal Conductivity 7.0

W/mK

-

ASTM D5470

Color Green

Visual

Viscosity  2000~3000

Pa·s

Brookfield

Density 3.5

g/cm3

ASTM D792

Volume Resistivity 1013

Ohm-m

ASTM D257

Working Temperature -50~+180

°C

Standard Package Tube/Pot

-

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Related materials Recommended

TG-NSP25 Non-Silicone Thermal Putty

●Silicone free thermal gel

●Shapeable and compressible

●Low thermal resistance

●No fluidity

●Best for north bridge IC

TG-NSP25 non-silicone thermally conductive paste is a kind of silicone-free thermally conductive paste with 2.5W/MK thermal conductivity. It has the character of sufficient compressibility and low thermal resistance. It can fill the gaps on the surface of the heat source with a small amount of mortar to achieve excellent thermal conductivity. Compared with thermal paste, it is more convenient for construction and has the characteristics of non-overflow and non-hardening.

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TG4040 Putty Thermal Putty

●Silicone-type spacer with great long term reliability

●Lower thermal resistance than thermal pads

●Physical property between liquid and solid state

●Elimination of different gap between heat source and the heatsink 

●Can be applied  with dispenser

TG4040 is a thermal putty and a gap filler between solid and liquid with excellent thermal conductivity of 3.2W/mK, low thermal resistance, and excellent long-term reliability. Only a small amount of TG putty is needed to fill the uneven gaps. This improves the flexible processability of the manufacturing end, is thinner, does not overflow, and does not harden, which is very suitable for components that do not require high-strength mechanical structural bonding, and provides better thermal conductivity.

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TG6060 Putty Thermal Putty

●Silicone-type spacer with great long term reliability

●Lower thermal resistance than thermal pads

●Physical property between liquid and solid state

●Elimination of different gap between heat source and the heatsink 

●Can be applied  with dispenser

TG6060 is a thermal putty its 6.3W/MK thermal conductivity also contains silicone cement.
This thermal pad is a relatively low thermal resistance due to its mud-like texture. Suitable for products with uneven heat sources. A small amount of cement can fill the gaps on the surface of the heat source to achieve excellent thermal conductivity. Compared with thermal paste, it is more convenient for construction and it has the characteristics of non-overflow and non-hardening. It is characterized by low thermal resistance, softness, strong plasticity, and environmental protection.
 

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