TG-A7000 Thermal Putty
-
●Silicone-type spacer with great long term reliability
-
●Lower thermal resistance than thermal pads
-
●Physical property between liquid and solid state
-
●Elimination of different heat source gap & heat sink
-
●Can be applied with dispenser
●Silicone-type spacer with great long term reliability
●Lower thermal resistance than thermal pads
●Physical property between liquid and solid state
●Elimination of different heat source gap & heat sink
●Can be applied with dispenser
TG-A7000 is a thermal putty T-Global has developed for the mortar industry with 7.0 W/m•K ultra-high thermal conductivity. It optimizes the heat dissipation performance of the product also it has an ultra-low heat group. This thermally conductive mortar is paste-like paste stickers, product design does not need to take special consideration of product size and tolerance restrictions, and can be flexibly designed according to the optimal effect of the design.
Application
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
Thermally conductive gels are widely used in LEDs, microprocessors, memory modules, cache memories, sealed integrated chips, DC/DC converters, IGBTs and other power modules, power semiconductors, solid-state relays, and bridge rectifiers.
| OPERATION MANUAL | |
 |
 |
| Push the latch and insert the stick | Put the tube in and twist |
 |
 |
| Close the cover | Take off the plug |
.png)
.png) |
.png) |
.png) |
 |
|
| Thermal Conductivity | 2.6 | 3.2 | 6.3 | 7.0 |
| Viscosity @0.5rpm | 5000 | 250(±100) | 270(±50) | 250 |
| Density | 2.6 | 2.9 | 3.3 | 3.25 |
| Volume Resistivity | 1014 | 1013 | 1013 | 1013 |
| Working Temperature | -50~+150 | -50~+180 | -50~+180 | -50~+180 |
Property table
| Properties | Unit |
TG-A7000 |
Tolerance | Test Method |
| Thermal Conductivity |
W/m•K |
7.0 |
- |
ASTM D5470 Modified |
| Color |
– |
Green |
– |
– |
| Viscosity |
Pa·s |
250 |
±100 |
Brookfield |
| Density |
g/cm3 |
3.25 |
– |
ASTM D792 |
| Volume Resistivity |
Ohm-m |
1013 |
– |
ASTM D257 |
| Operating Temperature |
°C |
-50~+180 |
– |
– |
| Standard Package |
- |
Tube/Pot |
– |
– |
| ●Need Samples? | ||||
(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
Related materials Recommended
●Silicone free thermal gel
●Shapeable and compressible
●Low thermal resistance
●No fluidity
●Best for north bridge IC
TG-NSP25 non-silicone thermally conductive paste is a kind of silicone-free thermally conductive paste with 2.6W/m•K thermal conductivity. It has the character of sufficient compressibility and low thermal resistance. It can fill the gaps on the surface of the heat source with a small amount of mortar to achieve excellent thermal conductivity. Compared with thermal paste, it is more convenient for construction and has the characteristics of non-overflow and non-hardening.
-
●Silicone-type spacer with great long term reliability
-
●Lower thermal resistance than thermal pads
-
●Physical property between liquid and solid state
-
●Elimination of different gap between heat source and the heatsink
-
●Can be applied with dispenser
TG4040 is a thermal putty and a gap filler between solid and liquid with excellent thermal conductivity of 3.2W/m•K, low thermal resistance, and excellent long-term reliability. Only a small amount of TG putty is needed to fill the uneven gaps. This improves the flexible processability of the manufacturing end, is thinner, does not overflow, and does not harden, which is very suitable for components that do not require high-strength mechanical structural bonding, and provides better thermal conductivity.
-
●Silicone-type spacer with great long term reliability
-
●Lower thermal resistance than thermal pads
-
●Physical property between liquid and solid state
-
●Elimination of different gap between heat source and the heatsink
-
●Can be applied with dispenser
TG6060 is a thermal putty its 6.3W/m•K thermal conductivity also contains silicone cement.
This thermal pad is a relatively low thermal resistance due to its mud-like texture. Suitable for products with uneven heat sources. A small amount of cement can fill the gaps on the surface of the heat source to achieve excellent thermal conductivity. Compared with thermal paste, it is more convenient for construction and it has the characteristics of non-overflow and non-hardening. It is characterized by low thermal resistance, softness, strong plasticity, and environmental protection.