TG-A09AB / TG-S09AB Potting Compound
-
●Good thermal conductivity
-
●Protect based material with high hardness for support
-
●A:B=1:1
-
●Room temperature or heating curing
●Good thermal conductivity
●Protect based material with high hardness for support
●A:B=1:1
●Room temperature or heating curing
TG-A09AB / TG-S09AB: is the thermally conductive sealant product newly developed by T-Global in 2022, Compared with the same type of silicone thermal conductive sealant, the thermal conductivity can reach 2.8W/m•K, it only takes 18 hours to cure the room temperature, and it only takes 30 minutes to heat and cure. After curing, it can protect electronic parts and prevent moisture and protect.
Application
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
In the modern era of the rapid rise of electric vehicles, Both the battery and the motor need to be filled with a potting curing sealant to achieve the effect of protection, waterproofing, and insulation, but the internal heat must be effectively conducted and dissipated. At this time, TG-A09AB / TG-S09AB silicone thermal conductive sealant is one it is a very good choice. Compared with other types of silicone sealant, TG-A09AB / TG-S09AB silicone type thermal conductive sealant has a superior thermal conductivity of 2.8W/m•K, fast curing time, and good AB glue storage method, which is not easy to store.
Property table
| Properties | Unit | TG-A09AB / TG-S09AB | Tolerance | Test Method | |
| Thermal Conductivity |
W/m•K |
2.8 |
±10% |
ASTM D5470 Modified |
|
| Color |
– |
Gray(Mix) |
– |
– |
|
| Dielectric Breakdown Voltage |
KV/mm |
≥11 |
– |
ASTM D149 |
|
| Volume Resistivity | Ohm-m | ≥1012 | – | ASTM D257 | |
| Density |
g/cm3 |
2.52 |
±5% |
ASTM D792 |
|
| Operating Temperature |
°C |
-50~+150 |
– |
– |
|
| Tensile Strength @3.0mm | kgf/cm2 | 230 | – | ASTM D412 | |
| Elongation | % | 55 | – | ASTM D412 | |
| Viscosity |
Pa·s |
10~50 |
– |
Brookfield |
|
| Weight Loss | % | <1 | ASTM D595 Modified | ||
| Curing Time @25°C | Hrs | 6 | ±10% | – | |
| Curing Time @50°C | Hrs | 0.6 | ±10% | – | |
| Curing Time @80°C | Hrs | 0.08 | ±10% | – | |
| Standard Package | – | Pot | – | – | |
| Hardness | Shore OO | 90 | ±10 | – | |
| Mixing Ratio | gram | 1:1 | – | – | |
| ●RoHS | |||||
| ●Need Samples? | |||||
|
●Component A & Component B are mixed material. It is normal to cause precipitation and stratification due to different density. |
|||||
(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
Related materials Recommended