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TG-A96AB / A96AB Potting Compound
- Epoxy based material with high hardness for support
- Protect components from any effect after curing
- Can be applied with dispenser
- Room temperature or heating curing
A96AB is an epoxy potting compound with 2.6W/m•K thermal conductivity. It is mixed with an AB agent. It is made with epoxy resin (Epoxy) as the base material. It has good thermal conductivity, insulation, and waterproof gas characteristics. It can be used by a dispenser and used in Maturation at room temperature or heating.
In a wide range of temperature and humidity changes, it can reliably protect sensitive circuits and components for a long time. This compound has high waterproof and insulating properties and high hardness. It can be used for support. It cannot be opened after potting. It is especially suitable for potting products with thermal conductivity requirements. Protect. Suitable for insulation and thermal conductivity potting of electronics, transformers, and industrial controllers.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Properties
Unit
TG-A96AB / A96AB Potting Compound
Testing methods
Thermal Conductivity
W/m•K
2.6±0.25
ASTM D5470 Modified
Color
White/Black
–
Dielectric Breakdown Voltage
KV/mm
≥11
ASTM D149
Volume Resistivity
Ohm-m
-
ASTM D257
Weight Loss
%
<1
ASTM E595 Modified
Density
g/cm³
2.5±5%
ASTM D792
Operating Temperature
°C
-25~+150
–
Viscosity
Pa·s
1.8~2.5
Brookfield
Curing Time @25°C
12Hrs
–
Curing Time @60°C
-
–
Curing Time @80°C
0.5Hrs
–
Curing Time @100°C
-
–
Hardness
Shore
A 68±10
ASTM D2240
Mixing Ratio
gram
13:1
–
Standard Package
Pot
–