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TG-A38KF High Performance Thermal Pad

  • Great thermal conductivity
  • Difficult to be deformed
  • Easy to assemble
  • Fiberglass on one side

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TG-A38KF is a soft gap filling material, glass fiber thermal conductive silicon film with thermal conductivity of 3.3W/m•K. This material has excellent thermal performance under low pressure. One mask is self-adhesive. On the other hand, because of its glass fiber characteristics, it can effectively increase the withstand voltage strength, and it is resistant to shear and tear, not easy to deform, and it has good thermal conductivity.

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Suitable for low-power products 

TG-A38K is formulated with unique 3.3W/m•K thermal conductivity. It also has excellent thermal conductivity under elevated pressure. In addition, this material has excellent self-adhesiveness, even if it encounters high roughness, and it can also show its high-performance bonding effect. Ideal for high-performance applications that require low assembly stress. This product is mostly used in applications such as the telecommunications industry, ASIC and DSP, consumer electronic products, and cooling modules. 

 

Application:

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

How to use thermal pad

Tearing off the release paper

Tearing off the release paper.

Attach the thermal pad to the heat source

Attach the thermal pad to the heat source.

Remove the protective film

Remove the protective film.

Apply components onto the exposed part

Apply components onto the exposed part.

Thermal Conductivity

Thermal Conductivity

Thermal conductivity refers to the ability of a given material to conduct/transfer heat.
Dielectric Breakdown Voltage

Dielectric Breakdown Voltage

Dielectric breakdown is the failure of an insulating material to prevent the flow of current under an applied electrical stress.
Hardness

Hardness

Higher numbers on the scale indicate a greater resistance to indentation and thus harder materials.

 

Properties
Unit
TG-A38KF High Performance Thermal Pad
Testing methods
Thermal Conductivity
W/m•K
3.3±10%
ASTM D5470 Modified
Thickness
mm
0.5~10.0
ASTM D374
Color
Blue
Colorimeter CIE 1976
Flame Rating
V-0
UL 94
Dielectric Breakdown Voltage
KV/mm
≥10
ASTM D149
Reinforcement Carrier
Fiberglass mesh
Weight Loss
%
<1
ASTM E595 Modified
Density
g/cm³
3.1±5%
ASTM D792
Operating Temperature
°C
-40~+200
Volume Resistivity
Ohm-m
3x10¹²
ASTM D257
Elongation
%
110 (Silicone Side)
ASTM D412
Standard Format
Sheet
Hardness(Silicone Side)
Shore
OO 60|±8 (Silicone Side)
ASTM D2240

 

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