【Two New Ultra-Soft High Conductivity Thermal Pads Have Gone to Market】
2024/05/03
【Two New Ultra-Soft High Conductivity Thermal Pads Have Gone to Market】 Specifically developed for network communications, cloud computing, servers, and other high-speed computing industries, these new products have outstanding thermal conductivity (6.5-7.5 W/m·K) and achieve an ultra-soft texture of Shore OO 25. Only a light amount of pressure is needed to achieve a seamless fit and fill the gaps between electronic components and heat sinks. This enables quicker and more effective heat dissipation, enhancing overall cooling performance.