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TG-AD65 Ultra Soft Thermal Pad
- High thermal conductivity
- Low thermal impedance
- Good electrical insulation
This thermal pad's ultra-soft texture can effectively fill the gaps between electronic components and heat sinks, achieving a seamless fit.
Specifically developed for network communications, cloud computing, servers, TG-AD65 have outstanding thermal conductivity (7.5 W/m·K) and achieve an ultra-soft texture of Shore OO 25. Only a light amount of pressure is needed to achieve a seamless fit and fill the gaps between electronic components and heat sinks. This enables quicker and more effective heat dissipation, enhancing overall cooling performance.
Application：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Tearing off the release paper.
Attach the thermal pad to the heat source.
Remove the protective film.
Apply components onto the exposed part.
Thermal Conductivity
Thermal conductivity refers to the ability of a given material to conduct/transfer heat.
Dielectric Breakdown Voltage
Dielectric breakdown is the failure of an insulating material to prevent the flow of current under an applied electrical stress.
Hardness
Higher numbers on the scale indicate a greater resistance to indentation and thus harder materials.
Properties
Unit
TG-AD65 Ultra Soft Thermal Pad
Testing methods
Thermal Conductivity
W/m•K
6.5
ASTM D5470 Modified
Thickness
mm
0.5~10
ASTM D374
Color
Yellow
Colorimeter CIE 1976
Flame Rating
V-0
UL 94
Dielectric Breakdown Voltage
KV/mm
≥4
ASTM D149
Weight Loss
%
<1
ASTM E595 Modified
Density
g/cm³
3.2
ASTM D792
Operating Temperature
°C
-50~+150
–
Volume Resistivity
Ohm-m
10¹²
ASTM D257
Elongation
%
60
ASTM D412
Standard Format
Sheet
–
Hardness(Silicone Side)
Shore OO
25
ASTM D2240