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T-Global NEWS
【EETimes x 2035 E-Mobility】T-Global comprehensive heat dissipation/thermal engineering materials
T-Global Technology showcased its comprehensive heat dissipation/thermal engineering materials at the E-Mobility Taiwan Exhibition from April 17th to April 20th, 2024. On-site product demonstrations included TIMs (Thermal Interface Materials), Heat Dissipation Modules, Vapor Chambers, Heat Pipes, and Thermoelectric Cooling Chips (TECs).
2024.05.10
T-Global NEWS
【Event Recap】Campus Engagement and EV Industry Expansion Both at Home and Abroad! Experts in Heat Dissipation and Thermal Conduction, T-Global Showcase Technical Prowess at the Taipei AMPA Exhibition.
The Taipei International Automobile & Motorcycle Parts & Accessories Show (Taipei AMPA), which ranks among the world's four largest and Asia's second-largest international B2B automotive and motorcycle parts exhibition, successfully concluded recently. Many renowned manufacturers participated in this event, including T-Global, an expert in heat dissipation and thermal conduction technology. Leveraging the Taipei AMPA exhibition’s reputation as an industry barometer, T-Global showcased its robust capabilities in the field of heat dissipation and thermal conduction.
2024.05.07
T-Global NEWS
University Student Dandelion Project(Taiwan Tech Racing Team)
Taiwan Tech Racing Team Achieves Impressive Results in Australia Expedition, winning the Best Contribution Award on their debut return to Taiwan. Among the battery modules, the TIM material was sponsored by T-Global Technology, utilizing the highest thermal conductivity TG-A1780 thermal pad, in active support of young students' pursuit of excellence and passion.
2024.04.03
T-Global NEWS