Compared to the traditional thermal technique, Thermal Bridge offers twice the thermal conductivity of performance. With the speed-up of systems of servers, network switches, and routers, the design and the needs of power supply get increasingly complicated. Therefore, the business comes up with another new way to solve the increasing heat source.  TE Thermal Bridge solution not only optimizes the RES but also becomes more reliable and durable for maintaining pieces of equipment.

As the engineers developing the computing and networking systems for next generation. TE’s thermal bridge solution simplifies the framework, reduce the number of the components, unlike the general thermal solution which requires additional mechanical compression devices to achieve the same result.

As an innovative leader of thermal solution, TE’s thermal bridge achieves the new level not only the performance but also the durability.

In the applications of input-output(I/O) with limited airflow, TE thermal bridge can significantly improve the ability of thermal conductivity in different thermal solution application such as coolant heat conduction, heat pipe heat conduction, multi-radiator heat conduction, and direct heat dissipation with the chassis.

It features virtually no gaps between the internal cooling stacks while minimizing compression requirements. In addition, its elastic compression design can prevent deformation or relaxation caused by long-term use, making the thermal conductivity durable and stable, and also reducing replacement during system maintenance. The heat dissipation bridge will be pre-installed on the I/O case, relying on compression force to pass through the heat dissipation stack, therefore the heat can be transferred from the I/O module to the cooling area.

 

Author

Professor Wei-Keng Lin

Education｜Ph.D., University of Maryland

Occupation｜Professor, National Tsing Hua University 

Specialty｜Electronic package heat dissipation, Heat pipe, Loop heat pipes(CPL，LHP，PHP), Energy-saving design, Solar heat storage and cooling, Heat flow system, Cooling of electronic components, Two-phase flow, Heat transfer elements of artificial satellite and high-altitude flying object