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TIM
Compression and thermal interface materials
For silicone based thermal interface materials, it is important to select the correct thickness to maintain a compression rate of 15-20% for the material. The appropriate compression level will vary depending on the softness of the material.
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Types and Application Methods of Thermal Interface Materials
Thermal interface materials include thermal pads, thermal tape, thermal grease and thermal putty. By filling the gap (0.1mm-20mm) between the chip/heating element and the heat sink, the medium for accelerating heat transfer can effectively conduct heat from the chip to the heat sink fin, thus reducing the chip temperature, increasing the chip life and product performance.
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Properties of Thermal Interface Materials
Most of the thermal pad products have silicone oil in them. T-Global has solved the problem of silicone oil precipitation through two high temperature chemical treatments and vacuum treatment. The company has also solved the problem of oil seepage by developing a non-silicone PC series thermal material.
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Properties and Applications of Thermal Tape
Thermal tape, also known as double-sided thermal adhesive tape, has high thermal conductivity, high viscosity and low thermal impedance, and can effectively replace thermal grease and mechanical fixing characteristics, and is used to fill the uneven gap between the heat source and the metal product, and bring the heat generated by electronic products away to achieve the effect of cooling and heat dissipation.
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Difference between thermal grease and thermal pad
Nowadays, the power supply of the motherboard has a higher heating capacity, but since the mos tube is not flat, it is not convenient to spread thermal grease, so a thermal pad can be attached to it.
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What is thermal paste?
Thermal paste (also known as heat sink compound, thermal silicone grease, high thermal conductivity thermal paste, chip thermal paste)
is a viscous fluid substance that is filled between components with incomplete flat and smooth surfaces. This compound, with a higher thermal conductivity than air, can effectively enhance the heat dissipation of components.