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Thermal Interface Materials
Phase Change Materials
TG-V833 Phase Change Materials
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TG-V833 Phase Change Materials
- With the good flow ability over phase change temperature,surface irregularities can be well filled.
- Low thermal impedance
TG-V833 thermally conductive phase change material is solid at room temperature, which is convenient for customers to assemble. When the device reaches the working temperature, the material will melt into a liquid state, and fully fill the uneven gaps on the surface of the component with good fluidity to reduce Thermal resistance, improve the thermal conductivity of products, often used in chipsets, processors, semiconductors and other products.
TG-V833 thermally conductive phase change material, solid at room temperature, not only has the convenience of assembly, but also has good thermal conductivity, because it will melt into a liquid when it reaches a certain working temperature, and it will be better integrated with the device. It can fill up the unequal gaps on the surface of the component, reduce thermal resistance, and achieve better thermal conductivity. This product can be used in a variety of different needs, such as: often used in chipsets, processors, laptops, Power Supply, mobile phones, motherboards, and various electrical products.
Applications：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Properties
Unit
TG-V833 Phase Change Materials
Testing methods
Thermal Conductivity
W/m·K
3.3±10%
ASTM D5470 Modified
Thickness
mm
0.13
ASTM D374
Color
Gray
–
Breakdown voltage(AC)
kV
≥1
ASTM D149
Operating Temperature
°C
-40~+125
–
Phase Transition Temperature
°C
50
–
Density
g / cm³
3.4±0.3
ASTM D792
Volume Resistivity
Ohm·m
3×10¹¹
ASTM D257
Thermal Impedance @10psi
°C*cm²/W
0.621
ASTM D5470 Modified
Thermal Impedance @30psi
°C*cm²/W
0.544
ASTM D5470 Modified
Thermal Impedance @50psi
°C*cm²/W
0.512
ASTM D5470 Modified
Dielectric Constant @1MHz
13.3
ASTM D150