Thermal Interface Material
Phase Change Materials
●With the good flow ability over phase change temperature,surface irregularities can be well filled.
●Low thermal impedance
Application
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED back light, Mother Board, Power Supply,Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, NIC, screens, etc.
Property table
| Properties | TG-V833 | TG-V838 | Unit | Tolerance | Test Method |
| Thermal Conductivity |
3.3 |
3.8 |
W / mK |
±10% |
ASTM D5470 |
| Thickness |
0.13/0.2/0.3 |
0.13/0.2/0.3 |
mm |
– |
ASTM D374 |
| 0.005/0.008/0.0118 | 0.005/0.008/0.0118 | inch | – | ASTM D374 | |
| Color |
Gray |
Gray |
– |
– |
Visual |
| Phase Transition Temperature |
50 |
50 |
°C |
– |
– |
| Breakdown voltage(Vac) | 1 | 1 | KV | ASTM D149 | |
| Density | 3.4 | 2.5 | g / cm3 | ±0.3 | ASTM D792 |
| Working Temperature |
-40~125 |
-40~125 |
°C |
– |
– |
| Volume Resistance |
3.0×1011 |
3.0×1010 |
Ohm-m |
– |
ASTM D257 |
| Thermal Impedance@50psi | 0.013 | 0.013 | °C-cm²/W | – | Modified ASTM D5470 |
| Dielectric Constant |
13.3 |
13.3 |
@1KHz |
– |
ASTM D412 |
| ●Compliance with REACH ●Compliance with RoHS | |||||
| ●Need samples? ●Pre-cut for different shapes |
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(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
Related materials Recommended
●With the good flow ability over phase change temperature,surface irregularities can be well filled.
●Low thermal impedance
●Insulation strength
●Low thermal resistance 0.402 (K in2/W) @ 50psi
●Easy to assemble
Polyimine is used as a substrate and is commonly used in electronic products that require high electrical insulation.
●Excellent thermal radiation
●Thin & bendable
●Available for unventilated design
●No dusting issue
Metal-based, with a radiant paint coating, can more effectively in product’s heat dissipation.