[New Product Launch] Low Bleed Series Thermal Pad

[New Product Launch] Low Bleed Series Thermal Pad
The properties of thermal conduction materials employed directly affect the performance and life span of electronics with high-speed computing and processing abilities.

TGlobal, leveraging its robust R&D capabilities, has released a low bleed thermal pad series. These thermal pads undergo rigorous testing and optimization to guarantee their quality and reliability. Even when operating at high temperatures for extended periods of use, devices employing TGlobal’s new thermal pads will maintain their stability and reliability while effectively containing silicon oil overflow. These new thermal pads significantly extend the lifespan of electronic components, providing various types of high-performance electronics equipment with highly reliable thermal management solutions.

These new models can be distinguished by their thermal conductivity coefficients (TG-A1800L 1.8 W/m•K; TG-A3200L 3.2 W/m•K). Each model is highly reliable, durable and heat resistant. Moreover, each model is suitable for various demanding ambient temperature conditions, enabling customers to select the most suitable thermal pad based on their specific product needs.