Thermal Interface Material

Thermal Putty

TG4040 Putty Thermal Putty
TG4040 Putty Thermal Putty
TG4040 Putty Thermal Putty
TG4040 Putty Thermal Putty
TG4040 Putty Thermal Putty

●Silicone-type spacer with great long term reliability

●Lower thermal resistance than thermal pads

●Physical property between liquid and solid state

●Elimination of different gap between heat source and the heatsink 

●Can be applied  with dispenser

Application

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.

Property table

  TG4040 Putty TG6060 Putty
Time Initial 200 Hr 400 Hr 700 Hr 1000 Hr Initial 200 Hr 400 Hr 700 Hr 1000 Hr
125℃ Aging 0.058 0.059 0.060 0.059 0.060 0.052 0.051 0.050 0.052 0.052
160℃ Aging 0.058 0.059 0.060 0.060 0.059 0.052 0.052 0.051 0.052 0.051
85℃ / 85% RH 0.058 0.059 0.060 0.059 0.060 0.052 0.051 0.050 0.052 0.051

 

Properties

TG4040

PUTTY

TG6060

PUTTY

Unit Tolerance Test Method
Thermal Conductivity

3.2

6.3

W / mK

±0.3

ASTM D5470

Color

Blue

Blue

Visual

Solid content

100 (one-part)

100 (one-part)

%

Viscosity 0.5rpm 

3,000

2.500~3.000

Pa·s

Brookfield

Density

3

3.3

g / cm3

ASTM D792

Volume Resistivity

1013

1013

Ohm-m

ASTM D257

Working Temperature

-50~180

-50~180

°C

Standard package

90g/ 165g/ 1KG

99g/181g/1KG

Tube/Pot

●Need samples?

(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)

Related materials Recommended

TG-NSP25 Non-Silicone Thermal Putty

●Silicone free thermal gel

●Shapeable and compressible

●Low thermal resistance

●No fluidity

●Best for north bridge IC

Submit
TG6060 Putty Thermal Putty

●Silicone-type spacer with great long term reliability

●Lower thermal resistance than thermal pads

●Physical property between liquid and solid state

●Elimination of different gap between heat source and the heatsink 

●Can be applied  with dispenser

Submit
S730 / TG-A730 Potting Compound

●Good thermal conductivity

●Heat curing

●Can be applied with pistol

●Low viscosity

●Easy to assemble

Submit
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