TG4040 Thermal Putty
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●Silicone-type spacer with great long term reliability
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●Lower thermal resistance than thermal pads
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●Physical property between liquid and solid state
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●Elimination of different gap between heat source and the heatsink
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●Can be applied with dispenser
●Silicone-type spacer with great long term reliability
●Lower thermal resistance than thermal pads
●Physical property between liquid and solid state
●Elimination of different gap between heat source and the heatsink
●Can be applied with dispenser
TG4040 is a thermal putty and a gap filler between solid and liquid with excellent thermal conductivity of 3.2W/m•K, low thermal resistance, and excellent long-term reliability. Only a small amount of TG putty is needed to fill the uneven gaps. This improves the flexible processability of the manufacturing end, is thinner, does not overflow, and does not harden, which is very suitable for components that do not require high-strength mechanical structural bonding, and provides better thermal conductivity.
Application
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
The thermal conductivity of TG4040 PUTTY reaches 3.2W/mK. Its thermal conductivity method is the same as that of thermal pads. TG4040 PUTTY products are very suitable for applications where thermally conductive silicon films cannot become the first choice, including the current very popular electric vehicles, as well as power supply, 5G communications, etc. It is between solid and liquid from TG. It’s one of the major advantages is its easy-to-spread characteristics. It is more suitable for uneven surfaces than thermal conductive silicon film Application, and more evenly fills the gap between the thermal component and the heat sink. The heat transfer can be maximized, and finally, the heat is dissipated through the radiator. And because it can be used as a thin layer, thermally conductive paste can provide better thermal conductivity and lower thermal mass than thermally conductive silicon film.
| OPERATION MANUAL | |
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| Push the latch and insert the stick | Put the tube in and twist |
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| Close the cover | Take off the plug |
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| Thermal Conductivity | 2.6 | 3.2 | 6.3 | 7.0 |
| Viscosity @0.5rpm | 5000 | 250(±100) | 270(±50) | 250 |
| Density | 2.6 | 2.9 | 3.3 | 3.25 |
| Volume Resistivity | 1014 | 1013 | 1013 | 1013 |
| Working Temperature | -50~+150 | -50~+180 | -50~+180 | -50~+180 |
Property table
| Properties | Unit |
TG4040 |
TG6060 |
Tolerance | Test Method |
| Thermal Conductivity |
W/m•K |
3.2 |
6.3 |
±0.3 |
ASTM D5470 Modified |
| Color |
– |
Blue |
– |
– |
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| Viscosity 0.5rpm |
Pa·s |
250(±100) |
270(±50) |
– |
Brookfield |
| Density |
g / cm3 |
2.9 |
3.3 |
±5% |
ASTM D792 |
| Volume Resistivity |
Ohm-mm |
1013 |
– |
ASTM D257 |
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| Operating Temperature |
°C |
-50~+180 |
– |
– |
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| Standard package | – |
Tube/Pot |
– |
– |
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| ●Need samples? | |||||
(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
Related materials Recommended
●Silicone free thermal gel
●Shapeable and compressible
●Low thermal resistance
●No fluidity
●Best for north bridge IC
TG-NSP25 non-silicone thermally conductive paste is a kind of silicone-free thermally conductive paste with 2.6W/m•K thermal conductivity. It has the character of sufficient compressibility and low thermal resistance. It can fill the gaps on the surface of the heat source with a small amount of mortar to achieve excellent thermal conductivity. Compared with thermal paste, it is more convenient for construction and has the characteristics of non-overflow and non-hardening.
-
●Silicone-type spacer with great long term reliability
-
●Lower thermal resistance than thermal pads
-
●Physical property between liquid and solid state
-
●Elimination of different gap between heat source and the heatsink
-
●Can be applied with dispenser
TG6060 is a thermal putty its 6.3W/m•K thermal conductivity also contains silicone cement.
This thermal pad is a relatively low thermal resistance due to its mud-like texture. Suitable for products with uneven heat sources. A small amount of cement can fill the gaps on the surface of the heat source to achieve excellent thermal conductivity. Compared with thermal paste, it is more convenient for construction and it has the characteristics of non-overflow and non-hardening. It is characterized by low thermal resistance, softness, strong plasticity, and environmental protection.
●Good thermal conductivity
●Heat curing
●Can be applied with pistol
●Low viscosity
●Easy to assemble
S730 is a silicone potting compound with 2.1W/m•K thermal conductivity and the mixing ratio is 1:1 which is easy to mix, can be matched with an extrusion gun for easy operation and easy construction, S730 thermally conductive sealant also has high stability, low viscosity, and quick-drying And other excellent characteristics.