TG-N8000 Non-Silicone Thermal Putty

TG-N8000 Non-Silicone Thermal Putty

•Silicone free thermal gel
•Lower contact thermal impedance than thermal pads
•Physical property in between liquid and solid state
•Gap fillers for uneven or irregular surfaces of heat sources and heat sink
•Applicable for dispenser


The high thermal conductivity material without added silicon oil is used to fill the gaps between electronic components and heat sinks. It retains stable thermal conductivity, resists loss and drying, and does not contaminate electronic components. With high temperature resistance and eco-friendly properties, it effectively transfers heat, ensuring optimal performance of electronic components under high temperatures and preventing damage due to overheating.

Application

Highly suitable for optical products, Advanced Driver Assistance Systems (ADAS), and sensitive electronic components.

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.

Property table

Properties Unit

TG-N8000

Tolerance Test Method
Thermal Conductivity

W/m•K

8.0

-

ASTM D5470 Modified

Color

Yellow

Viscosity

Pa·s

430

±100

Brookfield

Density

g/cm3

3

±0.15

ASTM D792

Volume Resistivity

Ohm-m

>1010

ASTM D257

Operating Temperature

°C

-40~+125

Standard Format

Tube / Pot

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(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)

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