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TG-N8000 Non-Silicone Thermal Putty
- Silicone free thermal gel
- Lower contact thermal impedance than thermal pads
- Physical property in between liquid and solid state
- Gap fillers for uneven or irregular surfaces of heat sources and heat sink
- Applicable for dispenser
The high thermal conductivity material without added silicon oil is used to fill the gaps between electronic components and heat sinks. It retains stable thermal conductivity, resists loss and drying, and does not contaminate electronic components. With high temperature resistance and eco-friendly properties, it effectively transfers heat, ensuring optimal performance of electronic components under high temperatures and preventing damage due to overheating.
Highly suitable for optical products, Advanced Driver Assistance Systems (ADAS), and sensitive electronic components.
Applications：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Operation Manual
Push the latch and insert the stick.
Put the tube in and twist.
Close the cover.
Take off the plug.
Properties
Unit
TG-N8000 Non-Silicone Thermal Putty
Testing methods
Thermal Conductivity
W/m·K
8.0
ASTM D5470 Modified
Color
Yellow
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Operating Temperature
°C
-40~+125
–
Density
g/cm³
3±0.15
ASTM D792
Viscosity
Pa·s
430±100
Brookfield Viscometer
Volume Resistivity
Ohm·m
>10¹º
ASTM D257
Standard Package
Tube/Pot
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