TG-N8000 Non-Silicone Thermal Putty
•Silicone free thermal gel
•Lower contact thermal impedance than thermal pads
•Physical property in between liquid and solid state
•Gap fillers for uneven or irregular surfaces of heat sources and heat sink
•Applicable for dispenser
The high thermal conductivity material without added silicon oil is used to fill the gaps between electronic components and heat sinks. It retains stable thermal conductivity, resists loss and drying, and does not contaminate electronic components. With high temperature resistance and eco-friendly properties, it effectively transfers heat, ensuring optimal performance of electronic components under high temperatures and preventing damage due to overheating.
Application
Highly suitable for optical products, Advanced Driver Assistance Systems (ADAS), and sensitive electronic components.
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
Property table
| Properties | Unit |
TG-N8000 Putty |
Tolerance | Test Method |
| Thermal Conductivity |
W/m•K |
8.0 |
- |
ASTM D5470 Modified |
| Color |
– |
Yellow |
– |
– |
| Viscosity |
Pa·s |
430 |
±100 |
Brookfield |
| Density |
g/cm3 |
3 |
±0.15 |
ASTM D792 |
| Volume Resistivity |
Ohm-m |
1010 |
– |
ASTM D257 |
| Operating Temperature |
°C |
-40~+125 |
– |
– |
| Standard Format |
– |
Tube / Pot |
– |
– |
| ●Need Samples? | ||||
(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
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