5G
Just nine years after the launch of 4G networks, the world began embracing the era of 5G, which offers 10 times better communication technology than 4G with ultra-low transmission latency. To realize the wide range of 5G services, it is crucial that the technological evolution of the underlying 4G infrastructure remains consistent and reliable. Utilizing various rollout plans and fiber optic transmission technologies to their full capacity will improve the latency of 5G. Wi-Fi6, which was launched alongside 5G, covers both high and low speed devices in the 2.4GHz and 5GHz bands and delivers four times more traffic than 5G. In the coming years, 5G networks combined with Wi-Fi6 will provide better network coverage.
With the higher speed and capacity of 5G comes additional heat dissipation challenges. Small base stations, edge computing devices and AI computing all require high wattage heat solutions. 5G supported consumer electronics, such as mobile phones and IoT-related devices, also necessitate a considerable load to prevent overheating that could reduce system efficiency or cause direct thermal shutdown. With years of experience in thermal engineering and research, coupled with knowledge gained through academic collaborations with universities, T-Global can assist you in overcoming your current thermal management challenges, particularly in addressing the increased heat dissipation demands posed by the development of 5G-related technologies.
Applications：
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Communication Antenna Modules
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5G Chips
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Surveillance Systems
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Radar Systems
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Base Stations
Fiber Optic Modules
Optical fiber modules produce a relatively large amount of heat. Given the limited internal space in the product design and demand for reliability, products with high thermal conductivity are often chosen.
Base Station
As long-term reliability is more important, it is advisable to opt for products that are made of soft materials and have a lower overall thermal resistance. Networks rely on switching and processing technology to achieve 3G, 4G and now even 5G status. As data traffic continues to rise, the network switching center base station must maintain a smooth flow of data, which generates relatively more heat. With limited internal space in the product design and the need for reliability, high thermal conductivity products are often preferred, which vary from low to high power. For example, heat pipes made of copper, combined with thermal interface materials, heat sink fins and fans, depending on the design of the mechanism, can effectively cope with heat loads of up to 100W.
