TG-A6200 Ultra Soft Thermal Pad

  • High thermal conductivity
  • High compressibility and compliancy
  • Natural tack

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A6200 thermal pad with 6.2W/m•K and it can perfectly attach to the heat source. With good thermal conductivity, high compressibility, self-adhesion and insulation.

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Technology is changing day by day, and electronic components are becoming smaller and smaller. But the electronic products and components function also getting bigger and bigger, due to more usage electronic products and components heat is getting higher and higher. To solve the heating problem it’s time to use T-Global “TG-A6200” Ultra Soft Thermal Pad to reduce the heat source and fill the air gap between the heat sink and components. This Thermal pad achieves and results from a good heat transfer effect. All the heat dissipation starts from the heat conduction, the heat conduction of TG-A6200 with a coefficient of 6.2W/m•K It’s an Ultra Soft Thermal Pad that meets the requirements of middle and low-end anti-heat and belongs to the middle-end flagship thermal conductive silicon film.

 

Application:

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

How to use thermal pad

Tearing off the release paper

Tearing off the release paper.

Attach the thermal pad to the heat source

Attach the thermal pad to the heat source.

Remove the protective film

Remove the protective film.

Apply components onto the exposed part

Apply components onto the exposed part.

Thermal Conductivity

Thermal Conductivity

Thermal conductivity refers to the ability of a given material to conduct/transfer heat.
Dielectric Breakdown Voltage

Dielectric Breakdown Voltage

Dielectric breakdown is the failure of an insulating material to prevent the flow of current under an applied electrical stress.
Hardness

Hardness

Higher numbers on the scale indicate a greater resistance to indentation and thus harder materials.

 

Properties
Unit
TG-A6200 Ultra Soft Thermal Pad
Testing methods
Thermal Conductivity
W/m•K
6.2±10%
ASTM D5470 Modified
Thickness
mm
0.5~8.0
ASTM D374
Color
Blue
Colorimeter CIE 1976
Flame Rating
V-0
UL 94
Dielectric Breakdown Voltage
KV/mm
≥10
ASTM D149
Weight Loss
%
<1
ASTM E595 Modified
Density
g/cm³
3.1±5%
ASTM D792
Operating Temperature
°C
-50~+180
Volume Resistivity
Ohm-m
1×10¹³
ASTM D257
Elongation
%
50
ASTM D412
Standard Format
Sheet
Hardness(Silicone Side)
Shore
OO 50|±15
ASTM D2240
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