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TG-A375S / L37-5S Thermal Pad
- Best for filling the gap
- Compliancy, high compressibility
- Ultra soft, low hardness (Shore OO)
- Lower pressure to heated components or PCB
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
This is the old series thermal pads, please contact our product consultant if you got any inquiry.
The new TG-A series thermal pad has better performance on the thermal conductivity, compressibility, with the ultra-soft softness, low thermal resistance and naturally tacky’s characteristics. It is often used as an interface material for IC and electronic heat dissipation, and is equipped with a heat pipe, vapor chamber and cooling modules.
Recommended ultra soft thermal pad Series
TG-A3500 Ultra Soft Thermal Pad |
Thermal Conductivity:3.5W/m•K ±10% |
Hardness:Shore OO 35 ±15 |
Dielectric Breakdown Voltage:≥ 13 KV/mm |