Engineered for High-Speed Computing – High-Performance Ultra-Soft Thermal Pad
This thermal pad's ultra-soft texture can effectively fill the gaps between electronic components and heat sinks, achieving a seamless fit.
2024.12.10
Product News
[New Product Launch] Low Bleed Series Thermal Pad
The properties of thermal conduction materials employed directly affect the performance and life span of electronics with high-speed computing and processing abilities.
This hybrid liquid and solid-state thermal conduction putty has low thermal impedance and contains non-volatile siloxane. It is suitable for optical and sensitive electronic components.
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![[New Product Launch] Low Bleed Series Thermal Pad](https://www.tglobalcorp.com/upload/news_list_pic/Low-Bleed-Series-Thermal-Pad-525-en.jpg__24F13l1bKO.jpg)
