2021.07.01
Industry Trends

Important Trends in Thermal Dissipation in the 5G Era

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5G時代散熱的重要趨勢

 

The advent of the 5G era has led to the need for higher cooling technology, and for 5G phones to become commonly available, the problem of heat dissipation will have to be addressed not just for mobile phones, but for many other electronic products in the future, making the technology of heat dissipation the mainstream!
When it comes to the future of the thermal dissipation sector, there are many opportunities.

 As electronic products become more sophisticated, more efficient and smaller in size, the market for heat dissipation is expanding. The demand for thermal modules for high-tech products continues to grow, as smartphones, NBs, graphics cards, networking and communication devices, base stations, data centers, high-speed computers, and even automotive electronics and AI industries all have huge cooling needs.

Other recent topics in the market include mid-range graphics cards, RTX systems, which are starting to gain momentum after their launch, and the demand for graphics card cooling. It is with these short-, medium- and long-term business opportunities and themes that the cooling sector is so buoyant! When it comes to thermal modules, there are several important components, such as cooling base plates, heat sinks, heat pipes, fans, etc., which can be customized according to customer requirements.

 In other words, the major manufacturers in the thermal industry are capable of making the entire thermal module after they have acquired the technology to produce a number of cooling components. The cooling base plate is the most basic component and is used in conjunction with other components to form a thermal module, The larger cooling fan is usually used in desktop computers, NBs and servers, etc., while the smaller heat pipe is used in NBs and smartphones. In addition, the 1D linear pipe form can be converted into a 2D heat sink, which can be used to raise the efficiency of heat dissipation and is already being introduced by major handset manufacturers.

 


林唯耕教授

Author

Professor Wei-Keng Lin

Education|Ph.D., University of Maryland

Occupation|Professor, National Tsing Hua University 

Specialty|Electronic package heat dissipation, Heat pipe, Loop heat pipes(CPL,LHP,PHP), Energy-saving design, Solar heat storage and cooling, Heat flow system, Cooling of electronic components, Two-phase flow, Heat transfer elements of artificial satellite and high-altitude flying object

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