Is 3D VC replacing water cooling as the new favorite?

Share：

3D VC

The 3D VC(Vapor Chamber) solution of a heat plate combined with a heat pipe has more cost advantages than a water cooling solution, and the volume space is more flexible. Currently, major heat dissipation factories are rushing to deploy it, including Auras, AVC, Nidec, etc. have research and development-related technologies. The concept of 3D VC has been around for about 4 to 5 years. Compared with the general hot plate, it has a modified appearance. Conceptually, it is a cylindrical heat pipe extending from the hot plate and connected to form a vacuum body. In the industry, according to sources the wattage of 3D VC can be increased to more than 500 watts, and can also be used in some high-end servers. It is more suitable for use in network communication products, from base stations to strong wave stations, computer rooms, etc.

The advantage of 3D VC is that it can absorb more heat than a hot plate. Additionally, it offers greater flexibility in terms of space and volume. It can be tailored to fit a customer's institutional equipment, making it highly customizable. However, creating a 3D VC is challenging. It requires combining vacuum bodies with different appearances, whether through structural welding or die-casting. Maintaining the yield rate of the vacuum chamber is also important. Different processes and production equipment exist, and approaches vary among manufacturers.

As chip performance continuously improves, the energy consumption of related equipment, such as HPC and AI, keeps increasing. This trend underscores the importance of cooling modules. Many in the industry believe that after the debut of the new Intel Eagle Stream platform in the first half of next year, the rise in power consumption will make 3D VC and water cooling the only two viable solutions for manufacturers.

Is 3D VC replacing water cooling as the new favorite?

Other points to take into consideration are credibility, reliability. The difficulties about water cooling is, with electronic products being contacted directly with water . So the key point of which is all about reliability and being durable. Based on the previous factory's research and development strategy, 3D VC solution by AVC, the maximum power consumption of 800W and above products, market observation, the current development of the wafer, after the efficiency proposal, and a promising update heat dissipation solution offering solutions and mobile products ASP.

AURAS devotes on water cooling, 3D VC simultaneous translation, comprehensive customer service plan,

A lot of customer is now having faith in the next generation server , customer tend to have positive attitude with water cooling, promising to release in the next year. Nidek continues to advance and expand there technical skills.

Overall, he efficiency of Wafer has been improved, causing the heat dissipation technology to also be improving, causing the unit price to rise, but also gain its status within the Red Sea market, breaking the price war, bringing the customer closer.

Author

Professor Wei-Keng Lin

Education｜Ph.D., University of Maryland

Occupation｜Professor, National Tsing Hua University

Specialty｜Electronic package heat dissipation, Heat pipe, Loop heat pipes(CPL，LHP，PHP), Energy-saving design, Solar heat storage and cooling, Heat flow system, Cooling of electronic components, Two-phase flow, Heat transfer elements of artificial satellite and high-altitude flying object

Privacy preferences

In accordance with the European Union’s General Data Protection Regulation (GDPR), we are committed to safeguarding and ensuring your control over your personal data. By clicking “Accept All” you are permitting us to use cookies to enhance your browsing experience, assist us in analyzing website performance and usage, and deliver relevant marketing content. You can manage your cookie settings below. By clicking “Confirm” you are agreeing to the current settings.