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![Research & Development of Heat Dissipation](https://www.tglobalcorp.com/upload/news_list_pic/enL_news_24B16_nzWy7l98ry.png)
Research & Development of Heat Dissipation
Today's thermal designs often combine a number of thermal components such as thermal interface materials, heat sinks, heat pipes, aluminum fins and fans. The thermal management of electronic products can only be achieved by analyzing each application scenario and its limitations with software.