Next-Gen Phase Change Material TG-PCM095 : Delivering Exceptional Thermal Performance for High-Heat Density Devices

Next-Gen Phase Change Material TG-PCM095 : Delivering Exceptional Thermal Performance for High-Heat Density Devices

Leveraging deep materials expertise and years of thermal R&D experience, T-Global Technology introduces the next-generation TG-PCM095 Phase Change Materials—a thermal interface solution that delivers high efficiency, stability, and long-term reliability for power modules, communication equipment, electric vehicles, and high-density computing applications.

2025.12.10
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Breaking the Boundaries of M.2 SSD Thermal Module | M.2 Fan SSD Thermal Module Unlocks Next-Generation Storage Performance

Breaking the Boundaries of M.2 SSD Thermal Module | M.2 Fan SSD Thermal Module Unlocks Next-Generation Storage Performance

To meet the future demands of high-power M.2 SSD, T-Global developed the M.2 Fan SSD Thermal Module. The module is equipped with TG-A6200 Ultra-Soft Thermal Pad and integrated with a 20x20x6.5mm hydraulic bearing fan. Capable of reaching a maximum speed of 17,000 ± 20% RPM, the fan operates with a low startup voltage and current of 7.0V/0.10A, delivering stable and powerful airflow to ensure effective cooling.

2025.10.02
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Tackle High-Heat Challenges – TG-ASD50AB Thermally Conductive Gel Officially Launched

Tackle High-Heat Challenges – TG-ASD50AB Thermally Conductive Gel Officially Launched

Discover TG-ASD50AB with 5.0 W/m·K thermal conductivity, optimized for 5G, EV, servers, and smart devices. RoHS & REACH compliant, ideal for high-efficiency thermal management.

2025.07.22
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New Flexible and Resilient Thermal Conductive Gel for Stable Automotive Electronics

New Flexible and Resilient Thermal Conductive Gel for Stable Automotive Electronics

TG-ASD35AB adopts a high-rebound design, allowing it to maintain a tight fit with heat-generating components even under high pressure.

2025.03.06
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Say Goodbye to Overheating! Brand-New M.2 SSD Thermal Module for Enhanced Stability and Performance

Say Goodbye to Overheating! Brand-New M.2 SSD Thermal Module for Enhanced Stability and Performance

In the era of high-speed storage, M.2 SSDs have become the core of high-performance computing. However, as transfer speeds continue to rise, overheating has emerged as a critical challenge affecting both performance and lifespan.

2025.02.14
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Engineered for High-Speed Computing – High-Performance Ultra-Soft Thermal Pad

Engineered for High-Speed Computing – High-Performance Ultra-Soft Thermal Pad

This thermal pad's ultra-soft texture can effectively fill the gaps between electronic components and heat sinks, achieving a seamless fit.

2024.12.10
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