Thermal Interface Material

Thermal Composite Material

Ti900 Thermal Insulator
Ti900 Thermal Insulator
Ti900 Thermal Insulator
Ti900 Thermal Insulator

●Insulation strength

●Low thermal resistance 0.402 (K in2/W) @ 50psi

●Easy to assemble


Polyimine is used as a substrate and is commonly used in electronic products that require high electrical insulation.

Application

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED back light, Mother Board, Power Supply,Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, NIC, screens, etc.

Property table

Properties Ti900 Unit Tolerance Test Method
Thermal Conductivity

1.9

W / mK

±10%

ASTM D5470

Thickness

0.12

mm

ASTM D374

Color

Gray

Visual

Base

Polyimide

Insulation Strength Vac

6.1

KV

ASTM D149

Volume resistance 

>1012

Ohm-m

ASTM D257

Working temperature

-50~180

°C

Tensile Strength

5000

psi

ASTM D412

Elongation

40

%

ASTM D412

Flame rating

V-0

UL 94

Standard Shape

Sheet ones

●Compliance with REACH  ●Compliance with RoHS  ●Compliance with UL

●Need samples?

●Pre-cut for different shapes

(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)

Related materials Recommended

PH3 Heat Spreader

●Excellent thermal radiation

●Thin & bendable 

●Available for unventilated design 

●No dusting issue 


Metal-based, with a radiant paint coating, can more effectively in product’s heat dissipation.

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TG-V838 Phase Change Materials

●With the good flow ability over phase change temperature,surface irregularities can be well filled.

●Low thermal impedance

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TG-V833 Phase Change Materials

●With the good flow ability over phase change temperature,surface irregularities can be well filled.

●Low thermal impedance

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