Ti900 Thermally Conductive Insulator
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●Insulation strength
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●Low thermal resistance 0.402 (K in2/W) @ 50psi
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●Easy to assemble
●Insulation strength
●Low thermal resistance 0.402 (K in2/W) @ 50psi
●Easy to assemble
Polyimine is used as a substrate and is commonly used in electronic products that require high electrical insulation.
Ti900 is a thermally conductive insulator with thermally conductive composite material that is characterized by insulation, flame resistance, tensile strength and is based on polyimide. It is often used in electronic products that require high electrical insulation.
●High electrical insulation
●Low thermal resistance
●Easy to construct"
Application
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED back light, Mother Board, Power Supply,Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, NIC, screens, etc.
Ti900 thermally conductive composite material uses polyimide as the base material. It has excellent thermal conductivity and excellent tensile strength. It is often used in electronic products that require high electrical insulation. Ti900 thermally conductive composite materials are widely used in motor control, power supply, and other industries, and have good thermal conductivity and insulation effects.
Property table
| Properties | Unit | Ti900 | Tolerance | Test Method |
| Thermal Conductivity |
W/m•K |
1.9 |
±10% |
ASTM D5470 Modified |
| Thickness |
mm |
0.12 |
– |
ASTM D374 |
| Color |
– |
Gray |
– |
– |
| Base |
– |
Polyimide |
– |
– |
| Dielectric Breakdown Voltage(AC) |
KV |
≥6.1 |
– |
ASTM D149 |
| Volume Resistance |
Ohm-m |
>1012 |
– |
ASTM D257 |
| Operating Temperature |
°C |
-50~+180 |
– |
– |
| Tensile Strength |
psi |
5000 |
– |
ASTM D412 |
| Elongation |
% |
40 |
– |
ASTM D412 |
| Flame rating |
– |
V-0 |
– |
UL 94 |
| Standard Format |
– |
Sheet |
– |
– |
| ●Compliance with REACH ●Compliance with RoHS ●Compliance with UL | ||||
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●Need samples? ●Die-cut for different shapes |
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(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
Related materials Recommended
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●Excellent thermal radiation
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●Thin & bendable
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●Available for unventilated design
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●No dusting issue
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●With the good flow ability over phase change temperature,surface irregularities can be well filled.
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●Low thermal impedance
TG-V838 is a thermal phase change material this phase change material is a heat-enhanced polymer, used to meet the thermal conductivity of high-end thermal conductivity applications, and has high reliability. The thermally conductive phase change material is solid at room temperature, which is convenient for customers to assemble. When the device reaches the working temperature, the material will be melted into a liquid state, and the gaps on the uneven surface of the component can be fully filled with good fluidity to reduce thermal resistance and improve the thermal efficiency of products is often used in chipsets, processors, semiconductors and other products.
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●With the good flow ability over phase change temperature,surface irregularities can be well filled.
-
●Low thermal impedance
TG-V833 thermally conductive phase change material is solid at room temperature, which is convenient for customers to assemble. When the device reaches the working temperature, the material will melt into a liquid state, and fully fill the uneven gaps on the surface of the component with good fluidity to reduce Thermal resistance, improve the thermal conductivity of products, often used in chipsets, processors, semiconductors and other products.