TG-A4500 Ultra Soft Thermal Pad
TG-A4500 Ultra Soft Thermal Pad

TG-A4500 Ultra Soft Thermal Pad

  • ●Very good thermal conductivity

  • ●High compressibility and compliancy

  • ●Natural tack


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Application

The application industry widely includes medium and high wattage electronic products such as electric vehicles, panels, displays, etc., and have good thermal conductivity 

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.

 

Tearing off the
release paper.
Gently attach the thermally
conductive silicon pad to the
heat source.
Remove the
protective film
Apply components onto
the exposed part and
apply pressure at fixture.

 

  TG-A20KX TG-A2200 TG-A3500 TG-A38KX TG-A4500
Thermal Conductivity 2.0 2.2 3.5 3.8 4.5
Dielectric Breakdown ≧12 ≧13 ≧13 ≧10 ≧10
Hardness (Shore00) 55 15 35 60 50

 

  TG-A6200 TG-A1250 TG-A1450 TG-A1660 TG-A1780
Thermal Conductivity 6.2 12.5 14.5 16.6 17.8
Dielectric Breakdown ≧10 ≧10 ≧8 ≧7 ≧8
Hardness (Shore00) 50 55 55 65 70

 

Thermal Conductivity
Thermal conductivity refers to the ability of a given material to conduct/transfer heat.
Dielectric Breakdown Voltage
Dielectric breakdown is the failure of an insulating material to prevent the flow of current
under an applied electrical stress.
Hardness
Higher numbers on the scale indicate a greater resistance to indentation
and thus harder materials.

Property table

Properties Unit TG-A4500 Tolerance Test Method
Thermal Conductivity

W/m•K

4.5

±10%

ASTM D5470 Modified

Thickness

mm

0.5~8.0

ASTM D374

inch

0.0197~0.3149

ASTM D374

Color

Purple

Colorimeter CIE 1976

Flame Rating

V-0

UL 94

Dielectric Breakdown Voltage

KV / mm

≥10

-

ASTM D149

Weight Loss

%

<1

ASTM E595 Modified

Density

g / cm3

3.1

±5%

ASTM D792

Operating Temperature °C -50 ~ +180
Volume Resistivity Ohm-m 1x1013 ASTM D257
Elongation

%

50

ASTM D412

Standard Format

Sheet

Hardness

Shore OO

50

±15

ASTM D2240

●Compliance with REACH  ●Compliance with RoHS 

●For thicknesses less than 1.0mm, hardness will be adjusted to 50-75 Shore OO to facilitate effective removal of liner during production
●Different tolerances according to the selected thickness
●Need samples?
●Die-cut for different shapes

(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)

Related materials Recommended

TG-A6200 Ultra Soft Thermal Pad
  • ●High thermal conductivity

  • ●High compressibility and compliancy

  • ●Natural tack


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A6200 thermal pad with 6.2W/m•K and it can perfectly attach to the heat source. With good thermal conductivity, high compressibility, self-adhesion and insulation.

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TG-A3500 Ultra Soft Thermal Pad
  • ●Very good thermal conductivity

  • ●High compressibility and compliancy

  • ●Natural tack


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Submit
TG-A2200 Ultra Soft Thermal Pad
  • ●One side is non-sticky and easy to assemble

  • ●Ultra soft and good compressibility

  • ●Good insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Submit
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