TG-A1780 Ultra Soft Thermal Pad
TG-A1780 Ultra Soft Thermal Pad

TG-A1780 Ultra Soft Thermal Pad

  • ●High thermal conductivity

  • ●Low thermal impedance

  • ●Good insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A1780 thermal pad with a conductivity of 17.8W/m•K is one of the high-end products among T-Global's many thermal interface materials. TG-A1780 is a product with high thermal conductivity, which is suitable for Netcom products that have a budget and require fast heat conduction, as well as various product applications. Efficiently it can help you to solve thermal problems and fast heat transmission. 

Application

Best for high power applications, high-wattage electronics such as electric vehicles, automation, 5G applications, servers, etc. 

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
TG-A1780 is a product with high thermal conductivity, which can help you solve the thermal problem with high efficiency. The customized product size and graphics are your first choice for fast heat conduction. The product size and design can be customized for fast heat conduction. It is suitable for Netcom products and a variety of different product applications. For example the most popular electric vehicle-related applications (including the system control panel in the car or the heat conduction solution required by the car chip), cloud applications, artificial intelligence, 5G base stations, automatic driving, and other products. It is suitable to use this high-performance thermal conductive material.

 

Tearing off the
release paper.
Gently attach the thermally
conductive silicon pad to the
heat source.
Remove the
protective film
Apply components onto
the exposed part and
apply pressure at fixture.

 

  TG-A20KX TG-A2200 TG-A3500 TG-A38KX TG-A4500
Thermal Conductivity 2.0 2.2 3.5 3.8 4.5
Dielectric Breakdown ≧12 ≧13 ≧13 ≧10 ≧10
Hardness (Shore00) 55 15 35 60 50

 

  TG-A6200 TG-A1250 TG-A1450 TG-A1660 TG-A1780
Thermal Conductivity 6.2 12.5 14.5 16.6 17.8
Dielectric Breakdown ≧10 ≧10 ≧8 ≧7 ≧8
Hardness (Shore00) 50 55 55 65 70

 

Thermal Conductivity
Thermal conductivity refers to the ability of a given material to conduct/transfer heat.
Dielectric Breakdown Voltage
Dielectric breakdown is the failure of an insulating material to prevent the flow of current
under an applied electrical stress.
Hardness
Higher numbers on the scale indicate a greater resistance to indentation
and thus harder materials.

Property table

Properties Unit TG-A1780 Tolerance Test Method
Thermal Conductivity

W/m•K

17.8

±10%

ASTM D5470 Modified

Thickness

mm

0.5~ 2.0

ASTM D374

inch

0.0197~ 0.0787

ASTM D374

Color

Light Gray

Colorimeter CIE 1976

Flame Rating

V-0

UL 94

Dielectric Breakdown Voltage

KV / mm

≥8

ASTM D149

Weight Loss

%

<1

ASTM E595 Modified

Density

g / cm3

3.5

±5%

ASTM D792

Operating Temperature °C -50~+180
Volume Resistivity Ohm-m 6x1012 ASTM D257
Elongation

%

20

ASTM D412

Standard Format

Sheet

Hardness

Shore OO

70

±10

ASTM D2240

●Compliance with REACH  ●Compliance with RoHS 

●For thicknesses less than 1.0mm, hardness will be adjusted to 50-75 Shore OO to facilitate effective removal of liner during production
●Different tolerances according to the selected thickness
●Need samples?
●Die-cut for different shapes

(The above table is only for reference. For the latest SPEC please press the DATASHEET button for download)

Related materials Recommended

TG-A1660 Ultra Soft Thermal Pad
  • ●High thermal conductivity

  • ●Low thermal impedance

  • ●Good insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A1660 thermal pad has a high thermal conductivity 16.6W/m•K, the flexible characteristics of soft materials can be attached to uneven surfaces, which fully conducts the heat source to the metal shell or diffuser plate to improve the efficiency and service life of the heating electronic components. 

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  • ●Low thermal impedance

  • ●Good insulation


By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A1450 is an ultra-soft thermal pad that has a high conductivity of 14.5W/m•K, and it has excellent characteristics of low thermal resistance. It also has good protection under the condition of high thermal conductivity. The hardness reaches 55 (Shore OO), and it is not easy to warp or twist. It can be cut into pieces according to requirements or punched according to the drawing surface. It has good workability and increases the utilization rate of the production line. The thickness is available from 0.5mm to 2.0mm, with good market price and performance.

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  • ●Low thermal resistance

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By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A1250 is an entry-level high thermal conductivity silicon film with 12.5W/m•K. Since 2019, it has been widely used in various electronic products, among which unmanned transportation vehicles, edge computing, industrial control hosts, servers, and other industries are the most.

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