Thermal Interface Material
Thermal Pad
●High thermal conductivity
●Low thermal impedance
●Good insulation
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Application
Best for high power applications, high-wattage electronics such as electric vehicles, automation, 5G applications, servers, etc.
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
Property table
| Properties | TG-A1450 | Unit | Tolerance | Test Method |
| Thermal Conductivity |
14.5 |
W / mK |
±10% |
ASTM D5470 |
| Thickness |
0.5~ 2.0 |
mm |
– |
ASTM D374 |
|
0.0197~ 0.0787 |
inch |
– |
ASTM D374 |
|
| Color |
Red |
– |
– |
Visual |
| Flame Rating |
V-0 |
– |
– |
UL 94 |
| Dielectric Breakdown Voltage |
4 |
KV / mm |
- |
ASTM D149 |
| Weight Loss |
<1 |
% |
– |
ASTM E595 |
| Density |
3.6 |
g / cm3 |
±10% |
ASTM D792 |
| Working Temperature | -50 ~ +150 | °C | – | – |
| Volume Resistance | 7x1012 | Ohm-m | – | ASTM D257 |
| Elongation |
30 |
% |
– |
ASTM D412 |
| Standard Shape |
Sheet ones |
– |
– |
– |
| Hardnes |
55 |
Shore 00 |
±10 |
ASTM D2240 |
|
●Compliance with REACH ●Compliance with RoHS ●Compliance with UL |
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(The above table is only for reference. For the lastest SPEC please press DATASHEET button for download)
Related materials Recommended
●High thermal conductivity
●Low thermal impedance
●Good insulation
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
●High thermal conductivity
●Low thermal impedance
●Good insulation
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
●High thermal conductivity up to 12.5 W/mK
●Low thermal resistance
●High compressibility and compliancy
●Electrical insulation
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.