Thermal Interface Material
Thermal Pad
●High thermal conductivity
●Low thermal impedance
●Good insulation
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A1450 is an ultra-soft thermal pad that has a high conductivity of 14.5W/MK, and it has excellent characteristics of low thermal resistance. It also has good protection under the condition of high thermal conductivity. The hardness reaches 60 (Shore 00), and it is not easy to warp or twist. It can be cut into pieces according to requirements or punched according to the drawing surface. It has good workability and increases the utilization rate of the production line. The thickness is available from 0.5mm to 2.0mm, with good market price and performance.
Application
Best for high power applications, high-wattage electronics such as electric vehicles, automation, 5G applications, servers, etc.
Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.
In recent years, all kinds of products have moved towards the aim of lightness, thinness, and shortness, but at the same time, the efficiency and power consumption have also increased by multiples, which has also led to the booming of heat dissipation and heat conduction issues. Under the greatly reduced space, the problem is how effectively the space can be used? TG-A1450 ultra-soft thermal pad is suitable for high-efficiency and high-power products. Because of the thermal conductivity efficiency, it can utilize superior thermal conductivity. Good softness and hardness can effectively fill the gaps in the applications. The manufacture is convenient and fast. It can be used in aeronautics, medical, automotive, electronics, and other fields.
Property table
| Properties | TG-A1450 | Unit | Tolerance | Test Method |
| Thermal Conductivity |
14.5 |
W / mK |
±10% |
ASTM D5470 |
| Thickness |
0.5~ 2.0 |
mm |
– |
ASTM D374 |
|
0.0197~ 0.0787 |
inch |
– |
ASTM D374 |
|
| Color |
Pink |
– |
– |
Visual |
| Flame Rating |
V-0 |
– |
– |
UL 94 |
| Dielectric Breakdown Voltage |
≥8 |
KV / mm |
- |
ASTM D149 |
| Weight Loss |
<1 |
% |
– |
ASTM E595 |
| Density |
3.6 |
g / cm3 |
±10% |
ASTM D792 |
| Working Temperature | -50~+180 | °C | – | – |
| Volume Resistance | 7x1012 | Ohm-m | – | ASTM D257 |
| Elongation |
30 |
% |
– |
ASTM D412 |
| Standard Format |
Sheets one |
– |
– |
– |
| Hardness |
55 |
Shore 00 |
±10 |
ASTM D2240 |
|
●Compliance with REACH ●Compliance with RoHS |
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(The above table is only for reference. For the latest SPEC please press the DATASHEET button for download)
Related materials Recommended
●High thermal conductivity
●Low thermal impedance
●Good insulation
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
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●High thermal conductivity
●Low thermal impedance
●Good insulation
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●Low thermal resistance
●High compressibility and compliancy
●Electrical insulation
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