TG-PCM095 Phase Change Materials
- Good flow rate over phase change temperature
- Fully filled the gaps of contact surface
- Low thermal impedance
T-Global’s TIM Phase Change Material, TG-PCM095, provides efficient thermal performance with a precise 45°C phase transition and excellent surface wetting. Its superior flow characteristics allow it to fill microscopic gaps, significantly lowering thermal impedance and improving overall heat transfer. Available in multiple thickness options, TG-PCM095 is well-suited for AI servers, 5G devices, automotive electronics, energy storage systems, and other high-power electronic applications.
TG-PCM095 phase change material enhances system temperature stability by utilizing controlled heat absorption and release at its 45°C phase transition point. During operation, the material softens and flows to fill micro-surface gaps, significantly reducing thermal impedance and improving overall thermal efficiency. It is widely applied in high-power processors, AI and 5G devices, electric vehicle electronics, industrial control systems, energy storage equipment, and advanced computing modules.
High-Performance Phase Change Thermal Materials
Efficient and Reliable TIM Phase Change Solutions
With high thermal conductivity (9.5 W/m·K) and low thermal impedance, TG-PCM095 delivers long-term reliability for high-density heat sources. It offers consistent phase change behavior, easy handling, and strong compatibility with diverse substrates. Engineered for next-generation computing and power systems, it supports applications requiring precise thermal control, stable performance, and customizable thermal interface options.
Applications：
Electronic Components – 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robotics, Servers, Smart Home, Telecom, etc.