TG-A6200F Fiberglass Reinforced Thermal Pad
- Very good thermal conductivity
- Fiberglass on one side
- Non deforming
- Electeical insulation
By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A6200F is the product with the highest thermal conductivity value in the series (5.0W/m·K), the thickness is available from 0.5mm to 8.0mm, which is relatively cost-effective and certain market share. It is an extension of the new product TG Thermal Pad developed by T-Global in the year 2019. It is a silicon film with glass fiber material attached to the surface to solve customers' suspicions about flexibility and abrasion resistance. With high performance withstand voltage value.
Due to the high protection, flexible and wear resistance of the TG-A6200F product itself, most of the product selection requires high thermal conductivity, high isolation, reuse, or continuous movement. Common uses such as equipment machine/mechanical arm /Industrial computers/Medical devices/Netcom equipment/Electric car accessories/Artificial intelligence products, thickness options available from 0.5mm to 8.0mm, and adhesive services are also available.
Applications：
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
Tearing off the release paper.
Attach the thermal pad to the heat source.
Remove the protective film.
Apply components onto the exposed part.
Thermal Conductivity
Dielectric Breakdown Voltage
Hardness