GT10D Thermal Pad

  • Smooth surface 
  • low thermal resistance
  • High stabality
  • Great reliability

GT10D is a thermal pad it is made with a glass fiber cloth, it has very good flexible strength. Because of this, it is not easy to be damaged in construction, allowing operators to perform more efficiently. It also quite withstands voltage. It is a thermally conductive silicone film with lower thermal resistance.

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With the development of technology, the design space of various electronic products has also become smaller. As the space becomes more limited, the space that can dissipate heat is also affected. GT10D can achieve a thickness of only 0.25mm, not only can efficiently conduct heat away but is also suitable for use in small spaces. This product is mainly used in power supplies and other related products such as TO-220, TO-3P, and other semiconductors. Because of the glass fiber, even if the screw is locked with a strong force, it is not easy to be damaged, and it can provide good heat conduction and insulation.

 

Applications:

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

How to use thermal pad

Tearing off the release paper

Tearing off the release paper.

Attach the thermal pad to the heat source

Attach the thermal pad to the heat source.

Remove the protective film

Remove the protective film.

Apply components onto the exposed part

Apply components onto the exposed part.

Thermal Conductivity

Thermal Conductivity

Thermal conductivity refers to the ability of a given material to conduct/transfer heat.
Dielectric Breakdown Voltage

Dielectric Breakdown Voltage

Dielectric breakdown is the failure of an insulating material to prevent the flow of current under an applied electrical stress.
Hardness

Hardness

Higher numbers on the scale indicate a greater resistance to indentation and thus harder materials.

 

Properties
Unit
GT10D Thermal Pad
Test Method
Thermal Conductivity
W/m·K
1.5±10%
ASTM D5470 Modified
Thickness
mm
0.25
ASTM D374
Color
-
Pink
Colorimeter CIE 1976
Dielectric Breakdown Voltage
kV
≥6
ASTM D149
Reinforcement Carrier
Fiberglass mesh
Weight Loss
%
<0.2
By T-Global
Density
g/cm³
2±5%
ASTM D792
Operating Temperature
°C
-45~+180
Volume Resistivity
Ohm·m
>10¹²
ASTM D257
Elongation
%
50
ASTM D412
Standard Format
-
Sheet
-
Hardness(Silicone Side)
Shore A
75±7
ASTM D2240
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