2025.06.01
Blog

Thermal Management Solutions

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Close-up and inside high performance Desktop PC and thermal management

Electronic equipment failures across sectors are 55% due to overheating. To fulfill the demanding needs of aircraft, automotive, and data centers, T-Global Technology designs and manufactures a collection of thermal interface materials, including phase change materials and non-silicone putty. Our European and Asian locations provide timely sampling and engineering assistance, so our thermal management solutions boost system reliability as well as performance.

 

Thermal Management Solutions Product Overview

 

T-Global offers many thermal management solutions to fulfill our customers' different demands.

 

Thermal Simulation Services

 

We utilize FloTHERM XT and FloEFD for thermal simulations. It lets us predict and solve thermal issues early in the design phase, which optimizes R&D costs and development timelines. Our engineers collaborate with clients for analyses and insights for better thermal performance.

 

Vapor Chambers

 

Our vapor chambers, or flat heat pipes, employ two-phase cooling to spread heat from high-density sources over larger surfaces. With high thermal conductivity materials, including aluminum alloy or copper, they give stable temperature distribution. It benefits applications with precise thermal control, such as electronics and thermal processing equipment.

 

Heat Pipes

 

To equalize temperatures fast, our heat pipes use the phase change of internal working fluids to transfer heat with efficiency. The internal capillary structure facilitates the return of condensed liquid to the evaporation zone for constant operation. It attains heat transfer coefficients approximately 50-100 times higher than pure aluminum in high-performance cooling systems.

 

Thermal Interface Materials

 

Our thermal interface materials (pads, tapes, greases, and putties) fill microscopic surface irregularities between components. They cut thermal resistance and boost heat conduction. They offer high-power electronic device performance with application-specific thermal conductivities.

 

Heat Sinks

 

Our heat sinks are manufactured from aluminum alloy 6063 and offer high thermal dissipation capabilities. They provide easy assembly while avoiding screws or holes. 

 

Thermoelectric Cooling Chips

 

With the Peltier effect, our thermoelectric cooling chips provide active cooling with temperature control. They are compact, lightweight, and reliable for applications in medical devices, refrigeration, and scientific instruments. The chips can realize temperature differences of 74°C when the hot side reaches 50°C. It delivers effective thermal management in key applications.

 

Flexible Absorbent Materials

 

Our flexible absorbing materials suppress electromagnetic interference across bandwidths (1 MHz to 18 GHz). They are ultra-thin, bendable, and can be cut to fit configurations. Altering magnetic flux paths averts resonance and coupling phenomena for sensitive electronic parts.

 

Cooling Fans

 

We offer cooling fans, including AC, DC, and EC types, for forced convection cooling. They maintain operating temperatures in electronic systems. They may be modified into cooling modules with heat sinks and thermal interface materials to fulfill thermal management needs.

 

T-Global: Your Thermal Management Expert

 

T-Global provides thermal management solutions for different sectors. Our expertise is in creating high thermal conductivity materials with conductivities above 5 W/mK to extend electronic component life. Cooling technologies in our product line, including vapor chambers and oscillating heat pipes, dissipate heat in compact electronic equipment. We strengthen the reliability of our customers' products with such solutions early in the design process.

 

Tailored Thermal Management Solutions

 

T-Global provides industry-specific thermal management solutions, including AI, automotive, medical, military, robotics, and 5G. For instance, high-performance processors create heat during machine learning and deep learning in AI applications. We use materials like thermal pads with conductivities from 1.8 to 5 W/mK to disperse heat and keep appropriate temperatures. 

 

Similarly, battery modules in electric vehicles demand precise heat management for efficiency and existence. We utilize thermally conductive gaskets with conductivities between 2 and 3 W/mK on battery surfaces for greater heat transmission to the exterior casing. Custom thermal interface materials and simulation services help create cooling systems that fulfill regulatory criteria for medical equipment, which needs reliability as well as precision.

 

T-Global provides ruggedized thermal pads with conductivities up to 6 W/mK and phase change materials for thermal cycling in military electronics. Motors and processors create localized heat that degrades robotic performance in autonomous systems and industrial automation. We use thermally conductive adhesives and gap fillers with up to 4 W/mK conductivity for heat transmission in small spaces. High-frequency transceivers and power amplifiers in 5G infrastructure need heat regulation to guarantee signal integrity. We use graphite sheets with thermal conductivities of 1500 W/mK and provide unique die-cut solutions for easy integration.

 

Technical Support

 

T-Global offers custom thermal management solutions. After receiving your CAD files (SolidWorks or Pro/ENGINEER), our engineers simulate and provide high-quality thermal analysis reports that optimize system configurations within your budget. We protect your design files with agreements and expedite your product development and product thermal performance.

 

We deliver technical support tools for thermal management solutions. Datasheets and documents in our Downloads section explain our products' thermal conductivities, material compositions, and application directions. Meanwhile, our FAQs cover issues, including heat sink sizes, surface area's effect on heat dissipation, and vapor chamber dimensions, for different calculations and considerations. Additionally, our Thermal Module Calculator assists in heat sink design by calculating thermal resistance and base temperature based on fin type, material, size, and airflow conditions.


Get experienced, customized thermal management advice from T-Global now!

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