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R&D talk about the heat dissipation


In the field of thermal management, to solve the problem of electronic heat dissipation, engineers must firstly understand the basic rules of conduction, convection, and radiation. Second, they must try to remove heat quickly to protect vital components. For heat dissipation in electronics, it is common to utilize a heat sink as a heat dissipation method, and also increase to the heat dissipation area.


   For heat sinking with space constraints, sometimes large surface areas are not viable for heat dissipation. From the point of view of convection, increasing the area means increasing the resistance, which is not necessarily effective. Furthermore, increasing the heat dissipation area also represents an increase in weight, which can increase costs. In general, heat sinks are still the most economical and effective thermal management technology. It can increase the heat conduction efficiency by improving the material properties, or changing the surface shape, or improving the temperature difference to increase the convection effect.


 Heat sinks are distinguished by mechanical processing, including extrusion, casting, forging, cutting, and others, with different effects, processes, and costs. The production cost and performance need to be considered in order to maximize the benefits of the heat sink. In the material of the heat sink, different materials can be selected to improve the thermal conductivity. The thermal conductivity of copper is 70% higher than aluminum. However, the weight and cost of copper are higher than aluminum. There are also many materials with high thermal conductivity with graphite that can be applied.


 The shape of design also will affect transmission, convection and conduction. The numbers of fins in the heat sink will affect the weight and cost directly. The surface treatment of heat sink will affect the heat dissipation. Radiation also accounts for about 20% of the entire natural heat dissipation. Black surfaces are good absorbers and radiators of heat. 


General speaking, anodizing can increase the radiation performance, thereby increasing the heat dissipation efficiency. It needs to be selected based on heat dissipation application scenarios, restrictions, conduction characteristics, and cost requirements.

Currently, the design of heat sink, often combines many heat dissipation elements, such as thermal interface materials, vapor chambers, heat pipes, heat sinks and fans. It is necessary to analyze the individual usage scenarios and restrictions with software to solve the thermal management problem of electronic products.



Editorial staff T-Global Marketing


T-Global R&D team

Team introduction –

A team of professional heat flow engineers, with independent and innovative research and development, provides customers with preliminary thermal simulation planning and institutional heat dissipation design consulting. In the face of evolving market trends, they can quickly respond and continue to provide innovative anti-heat solutions.